JPS5735373A - Manufacture of planar type thyristor - Google Patents
Manufacture of planar type thyristorInfo
- Publication number
- JPS5735373A JPS5735373A JP11194780A JP11194780A JPS5735373A JP S5735373 A JPS5735373 A JP S5735373A JP 11194780 A JP11194780 A JP 11194780A JP 11194780 A JP11194780 A JP 11194780A JP S5735373 A JPS5735373 A JP S5735373A
- Authority
- JP
- Japan
- Prior art keywords
- current
- thyristor
- oxygen
- planar type
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 3
- 239000001301 oxygen Substances 0.000 abstract 3
- 229910052760 oxygen Inorganic materials 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
- H01L29/7404—Thyristor-type devices, e.g. having four-zone regenerative action structurally associated with at least one other device
- H01L29/7412—Thyristor-type devices, e.g. having four-zone regenerative action structurally associated with at least one other device the device being a diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thyristors (AREA)
Abstract
PURPOSE:To set the gate trigger current of a thyristor at a desired level by a method wherein thyristor surface charge density is regulated by heating in an atmosphere of oxygen. CONSTITUTION:An SiO2 film 6 is formed on an exposed surface along the junction border of a planar type thyristor silicon chip 1. The film is first heated in an oxygen current and then is let to gradually cool down and be sintered in a nitrogen current. It is again heated in an oxygen current, to be cooled in an nitrogen current again. A cooling speed is selected and a thyristor gate trigger current is set at a desired value.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11194780A JPS5735373A (en) | 1980-08-11 | 1980-08-11 | Manufacture of planar type thyristor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11194780A JPS5735373A (en) | 1980-08-11 | 1980-08-11 | Manufacture of planar type thyristor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5735373A true JPS5735373A (en) | 1982-02-25 |
JPS6146067B2 JPS6146067B2 (en) | 1986-10-11 |
Family
ID=14574128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11194780A Granted JPS5735373A (en) | 1980-08-11 | 1980-08-11 | Manufacture of planar type thyristor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5735373A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60169142A (en) * | 1984-02-10 | 1985-09-02 | Sony Corp | Manufacture of semiconductor device |
JPH03225959A (en) * | 1990-01-31 | 1991-10-04 | Sharp Corp | Manufacture of solid-state image sensing element |
CN103700591A (en) * | 2013-12-26 | 2014-04-02 | 鞍山市华辰电力器件有限公司 | Method for manufacturing high-voltage large-power thyristor by adopting sintering process |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105575893A (en) | 2016-01-05 | 2016-05-11 | 京东方科技集团股份有限公司 | Display substrate and fabrication method thereof and display device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339744A (en) * | 1976-09-24 | 1978-04-11 | Keihoku Seiki Seisakushiyo Yuu | Long film mount and file sheet |
-
1980
- 1980-08-11 JP JP11194780A patent/JPS5735373A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339744A (en) * | 1976-09-24 | 1978-04-11 | Keihoku Seiki Seisakushiyo Yuu | Long film mount and file sheet |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60169142A (en) * | 1984-02-10 | 1985-09-02 | Sony Corp | Manufacture of semiconductor device |
JPH03225959A (en) * | 1990-01-31 | 1991-10-04 | Sharp Corp | Manufacture of solid-state image sensing element |
CN103700591A (en) * | 2013-12-26 | 2014-04-02 | 鞍山市华辰电力器件有限公司 | Method for manufacturing high-voltage large-power thyristor by adopting sintering process |
Also Published As
Publication number | Publication date |
---|---|
JPS6146067B2 (en) | 1986-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5743438A (en) | Semiconductor device and manufacture thereof | |
JPS5530846A (en) | Method for manufacturing fixed memory | |
JPS5735373A (en) | Manufacture of planar type thyristor | |
JPS5766671A (en) | Semiconductor device | |
JPS5726467A (en) | Manufacture of semiconductor device | |
JPS55141748A (en) | Thin film resistor for mos field effect transistor | |
JPS5444880A (en) | Manufacture of semiconductor device | |
JPS5323574A (en) | Forming method of silicon oxide film | |
JPS56125846A (en) | Surface treatment of semiconductor | |
JPS5681969A (en) | Manufacture of semiconductor device | |
JPS5776873A (en) | Manufacture of semiconductor device | |
JPS5346272A (en) | Impurity diffusion method | |
JPS5618466A (en) | Manufacture of semiconductor device | |
JPS5727055A (en) | Semiconductor device | |
JPS54151379A (en) | Manufactue for semiconductor device | |
JPS5649575A (en) | Junction type field effect semiconductor | |
JPS54153581A (en) | Manufacture for thyristor | |
JPS54142974A (en) | Diffusing method for aluminum | |
JPS5724536A (en) | Preparation of semiconductor device | |
JPS56110226A (en) | Forming method of impurity doped region in semiconductor substrate | |
JPS57113242A (en) | Marking device for semiconductor wafer | |
JPS5428566A (en) | Manufacture of semiconductor device | |
JPS5354972A (en) | Production of semiconductor device | |
JPS57172767A (en) | Manufacture of semiconductor device | |
JPS52146568A (en) | Production of silicon gate mos type semiconductor integrated circuit device |