JPS57113242A - Marking device for semiconductor wafer - Google Patents

Marking device for semiconductor wafer

Info

Publication number
JPS57113242A
JPS57113242A JP18821280A JP18821280A JPS57113242A JP S57113242 A JPS57113242 A JP S57113242A JP 18821280 A JP18821280 A JP 18821280A JP 18821280 A JP18821280 A JP 18821280A JP S57113242 A JPS57113242 A JP S57113242A
Authority
JP
Japan
Prior art keywords
mark
laser
emission
laser mark
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18821280A
Other languages
Japanese (ja)
Inventor
Akitoshi Tezuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP18821280A priority Critical patent/JPS57113242A/en
Publication of JPS57113242A publication Critical patent/JPS57113242A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enable the formation of a large and stable laser mark with a low power device by forming a mark by emitting the laser light continuously at least more than twice. CONSTITUTION:A laser mark is formed on the surface of a semiconductor device by emitting first laser light. In other words, the metal wire 1 on the surface of the semiconductor device and a part of an oxidized film 2 are heated and molten by the laser light to form a laser mark. At this time the periphery of the laser mark is not molten, but becomes high temperature. When second emission of the laser mark is performed, a large laser mark 3' is formed. The mark 3' formed by the second emission is much larger than that produced at the first emission and stable.
JP18821280A 1980-12-29 1980-12-29 Marking device for semiconductor wafer Pending JPS57113242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18821280A JPS57113242A (en) 1980-12-29 1980-12-29 Marking device for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18821280A JPS57113242A (en) 1980-12-29 1980-12-29 Marking device for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS57113242A true JPS57113242A (en) 1982-07-14

Family

ID=16219723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18821280A Pending JPS57113242A (en) 1980-12-29 1980-12-29 Marking device for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57113242A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003038895A1 (en) * 2001-10-30 2003-05-08 Motorola, Inc. Wafer scribing method and wafer scribing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003038895A1 (en) * 2001-10-30 2003-05-08 Motorola, Inc. Wafer scribing method and wafer scribing device
US6914006B2 (en) 2001-10-30 2005-07-05 Freescale Semiconductor, Inc. Wafer scribing method and wafer scribing device

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