JPS5735338A - Semiconductor ic device - Google Patents
Semiconductor ic deviceInfo
- Publication number
- JPS5735338A JPS5735338A JP10983780A JP10983780A JPS5735338A JP S5735338 A JPS5735338 A JP S5735338A JP 10983780 A JP10983780 A JP 10983780A JP 10983780 A JP10983780 A JP 10983780A JP S5735338 A JPS5735338 A JP S5735338A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- wirings
- cathode electrode
- shape
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
- Element Separation (AREA)
Abstract
PURPOSE:To reduce the current density of each wiring and obtain high density integration by a method whereincathode wirings are divided and taken out in parallel and crossover of cathode wirings and gate wirings is provided. CONSTITUTION:A plurality of rectangular PB's23 are composed by SiO2 film 19 in an n type semiconductor substrate 21 which is an isolation region from a multi-crystal Si supporting base 20. Inside each PB23, an nE24 is composed in U-shape along its three sides, and a PE22 of a comb-shape is formed. In each region, electrodes of an anode 26, a cathode 27 and a gate 28 are formed through apertures in a surface insulating film 15. The cathode electrode 27 is composed in U-shape on the nE24 in the PB23 and the both ends of the cathode electrode 27 are connected to a lead conductor 30 in parallel, thus the cathode can carry the current 4 times as large as the current carrying capacity of each cathode electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10983780A JPS5735338A (en) | 1980-08-12 | 1980-08-12 | Semiconductor ic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10983780A JPS5735338A (en) | 1980-08-12 | 1980-08-12 | Semiconductor ic device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5735338A true JPS5735338A (en) | 1982-02-25 |
Family
ID=14520455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10983780A Pending JPS5735338A (en) | 1980-08-12 | 1980-08-12 | Semiconductor ic device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5735338A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60146296A (en) * | 1984-01-11 | 1985-08-01 | 株式会社荏原製作所 | Wide band sound absorbing mechanism |
-
1980
- 1980-08-12 JP JP10983780A patent/JPS5735338A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60146296A (en) * | 1984-01-11 | 1985-08-01 | 株式会社荏原製作所 | Wide band sound absorbing mechanism |
JPH0476117B2 (en) * | 1984-01-11 | 1992-12-02 | Ebara Mfg |
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