JPS5734347A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5734347A
JPS5734347A JP10962480A JP10962480A JPS5734347A JP S5734347 A JPS5734347 A JP S5734347A JP 10962480 A JP10962480 A JP 10962480A JP 10962480 A JP10962480 A JP 10962480A JP S5734347 A JPS5734347 A JP S5734347A
Authority
JP
Japan
Prior art keywords
layer
contact electrode
film
bump
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10962480A
Other languages
Japanese (ja)
Inventor
Shusaku Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10962480A priority Critical patent/JPS5734347A/en
Publication of JPS5734347A publication Critical patent/JPS5734347A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To prevent exfoliation of a contact electrode in a photosuperpower type infrared ray detection element, wherein a contact electrode layer set on the first insulated film is coated with the second insulated film, whereon a hole is opened to form a metal bump. CONSTITUTION:For instance a p type diffusion layer 2 is formed on an n type HgCdTe substrate 1, a contact electrode 5 consisting of a Cr-layer 5a, Au-layer 5b and an In-layer 5c is formed through an opening 4 of an insulated film 3 consisting of ZnS to be made into an infrared ray detection element. The whole upper part thereof is coated with a ZnS film 8 and an opening 8' is formed on a bump forming region by a resist mask 7. Next, after exfoliating the resist layer 7 the bump electrode 6 is formed on the contact electrode 5. Thereby, in the forming process the resist film 7 does not directly and tightly adhere to the contact metal 5 so that the latter can be prevented from exfoliation thus to improve the yield.
JP10962480A 1980-08-09 1980-08-09 Manufacture of semiconductor device Pending JPS5734347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10962480A JPS5734347A (en) 1980-08-09 1980-08-09 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10962480A JPS5734347A (en) 1980-08-09 1980-08-09 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5734347A true JPS5734347A (en) 1982-02-24

Family

ID=14514996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10962480A Pending JPS5734347A (en) 1980-08-09 1980-08-09 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5734347A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078216U (en) * 1983-11-02 1985-05-31 株式会社堀部マシンサービス Deburring machine
JPH02172221A (en) * 1988-12-23 1990-07-03 Nec Corp Manufacture of semiconductor substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6078216U (en) * 1983-11-02 1985-05-31 株式会社堀部マシンサービス Deburring machine
JPH02172221A (en) * 1988-12-23 1990-07-03 Nec Corp Manufacture of semiconductor substrate

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