JPS5734333A - Proximity system double face exposure device - Google Patents
Proximity system double face exposure deviceInfo
- Publication number
- JPS5734333A JPS5734333A JP10830180A JP10830180A JPS5734333A JP S5734333 A JPS5734333 A JP S5734333A JP 10830180 A JP10830180 A JP 10830180A JP 10830180 A JP10830180 A JP 10830180A JP S5734333 A JPS5734333 A JP S5734333A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- foil
- proximity
- frame
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10830180A JPS5734333A (en) | 1980-08-08 | 1980-08-08 | Proximity system double face exposure device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10830180A JPS5734333A (en) | 1980-08-08 | 1980-08-08 | Proximity system double face exposure device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5734333A true JPS5734333A (en) | 1982-02-24 |
JPS6156868B2 JPS6156868B2 (ja) | 1986-12-04 |
Family
ID=14481213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10830180A Granted JPS5734333A (en) | 1980-08-08 | 1980-08-08 | Proximity system double face exposure device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5734333A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4784922A (en) * | 1985-10-11 | 1988-11-15 | Mitsubishi Steel Mfg. Co., Ltd. | Corrosion-resistant clad steel and method for producing the same |
JPH05105965A (ja) * | 1991-10-16 | 1993-04-27 | Nippon Steel Corp | 延性に優れた高強度ビードワイヤの製造方法 |
JPH05117764A (ja) * | 1991-10-24 | 1993-05-14 | Nippon Steel Corp | 高強度ビードワイヤの製造方法 |
US5554233A (en) * | 1994-05-26 | 1996-09-10 | Inland Steel Company | Cold deformable, high strength, hot rolled bar and method for producing same |
US6206984B1 (en) * | 1998-05-13 | 2001-03-27 | Kabushiki Kaisha Kobe Seiko Sho | Non-heat treated wire or bar steel for springs |
KR100651819B1 (ko) * | 1999-07-16 | 2006-11-30 | 삼성테크윈 주식회사 | 노광장치 |
US7255220B2 (en) | 2002-12-20 | 2007-08-14 | Honda Motor Co., Ltd. | Conveyance system |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5555528A (en) * | 1978-10-20 | 1980-04-23 | Hitachi Ltd | Mask aligner |
-
1980
- 1980-08-08 JP JP10830180A patent/JPS5734333A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5555528A (en) * | 1978-10-20 | 1980-04-23 | Hitachi Ltd | Mask aligner |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4784922A (en) * | 1985-10-11 | 1988-11-15 | Mitsubishi Steel Mfg. Co., Ltd. | Corrosion-resistant clad steel and method for producing the same |
JPH05105965A (ja) * | 1991-10-16 | 1993-04-27 | Nippon Steel Corp | 延性に優れた高強度ビードワイヤの製造方法 |
JPH05117764A (ja) * | 1991-10-24 | 1993-05-14 | Nippon Steel Corp | 高強度ビードワイヤの製造方法 |
US5554233A (en) * | 1994-05-26 | 1996-09-10 | Inland Steel Company | Cold deformable, high strength, hot rolled bar and method for producing same |
US6206984B1 (en) * | 1998-05-13 | 2001-03-27 | Kabushiki Kaisha Kobe Seiko Sho | Non-heat treated wire or bar steel for springs |
KR100651819B1 (ko) * | 1999-07-16 | 2006-11-30 | 삼성테크윈 주식회사 | 노광장치 |
US7255220B2 (en) | 2002-12-20 | 2007-08-14 | Honda Motor Co., Ltd. | Conveyance system |
Also Published As
Publication number | Publication date |
---|---|
JPS6156868B2 (ja) | 1986-12-04 |
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