JPS5732346A - Mother alloy for oxidation resistant lead-tin solder - Google Patents

Mother alloy for oxidation resistant lead-tin solder

Info

Publication number
JPS5732346A
JPS5732346A JP10861880A JP10861880A JPS5732346A JP S5732346 A JPS5732346 A JP S5732346A JP 10861880 A JP10861880 A JP 10861880A JP 10861880 A JP10861880 A JP 10861880A JP S5732346 A JPS5732346 A JP S5732346A
Authority
JP
Japan
Prior art keywords
point
solder
mother alloy
alloy
oxidation resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10861880A
Other languages
English (en)
Other versions
JPS601937B2 (ja
Inventor
Shiro Katayama
Fumio Nakaya
Kenji Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP10861880A priority Critical patent/JPS601937B2/ja
Publication of JPS5732346A publication Critical patent/JPS5732346A/ja
Publication of JPS601937B2 publication Critical patent/JPS601937B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Coating With Molten Metal (AREA)
  • Conductive Materials (AREA)
JP10861880A 1980-08-06 1980-08-06 耐酸化性鉛錫半田用母合金 Expired JPS601937B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10861880A JPS601937B2 (ja) 1980-08-06 1980-08-06 耐酸化性鉛錫半田用母合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10861880A JPS601937B2 (ja) 1980-08-06 1980-08-06 耐酸化性鉛錫半田用母合金

Publications (2)

Publication Number Publication Date
JPS5732346A true JPS5732346A (en) 1982-02-22
JPS601937B2 JPS601937B2 (ja) 1985-01-18

Family

ID=14489353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10861880A Expired JPS601937B2 (ja) 1980-08-06 1980-08-06 耐酸化性鉛錫半田用母合金

Country Status (1)

Country Link
JP (1) JPS601937B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186671A (ja) * 1984-10-04 1986-05-02 Tech Res & Dev Inst Of Japan Def Agency レ−ダ装置
CN102476250A (zh) * 2010-11-25 2012-05-30 中国科学院金属研究所 一种耐大气腐蚀的Sn-Pb焊料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6186671A (ja) * 1984-10-04 1986-05-02 Tech Res & Dev Inst Of Japan Def Agency レ−ダ装置
CN102476250A (zh) * 2010-11-25 2012-05-30 中国科学院金属研究所 一种耐大气腐蚀的Sn-Pb焊料

Also Published As

Publication number Publication date
JPS601937B2 (ja) 1985-01-18

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