JPS5729185U - - Google Patents
Info
- Publication number
- JPS5729185U JPS5729185U JP1980105728U JP10572880U JPS5729185U JP S5729185 U JPS5729185 U JP S5729185U JP 1980105728 U JP1980105728 U JP 1980105728U JP 10572880 U JP10572880 U JP 10572880U JP S5729185 U JPS5729185 U JP S5729185U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
- H01L27/013—Thick-film circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980105728U JPS5729185U (ja) | 1980-07-28 | 1980-07-28 | |
US06/287,683 US4424251A (en) | 1980-07-28 | 1981-07-28 | Thick-film multi-layer wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980105728U JPS5729185U (ja) | 1980-07-28 | 1980-07-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5729185U true JPS5729185U (ja) | 1982-02-16 |
Family
ID=14415352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980105728U Pending JPS5729185U (ja) | 1980-07-28 | 1980-07-28 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4424251A (ja) |
JP (1) | JPS5729185U (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5911700A (ja) * | 1982-07-12 | 1984-01-21 | 株式会社日立製作所 | セラミツク多層配線回路板 |
JPS59126665A (ja) * | 1983-01-10 | 1984-07-21 | Hitachi Ltd | 厚膜混成集積回路 |
JPS6028296A (ja) * | 1983-07-27 | 1985-02-13 | 株式会社日立製作所 | セラミツク多層配線回路板 |
FR2553934B1 (fr) * | 1983-10-19 | 1986-09-05 | Labo Electronique Physique | Structure semi-conducteur-support vitreux et dispositifs realises avec une telle structure |
JPS60113993A (ja) * | 1983-11-25 | 1985-06-20 | 三菱電機株式会社 | 多層回路基板の製造方法 |
US4582745A (en) * | 1984-01-17 | 1986-04-15 | Rca Corporation | Dielectric layers in multilayer refractory metallization structure |
US4582748A (en) * | 1984-01-26 | 1986-04-15 | Owens-Corning Fiberglas Corporation | Glass compositions having low expansion and dielectric constants |
JPS60208886A (ja) * | 1984-03-31 | 1985-10-21 | 株式会社東芝 | 電子部品の製造方法 |
US4536328A (en) * | 1984-05-30 | 1985-08-20 | Heraeus Cermalloy, Inc. | Electrical resistance compositions and methods of making the same |
JPS61194794A (ja) * | 1985-02-22 | 1986-08-29 | 三菱電機株式会社 | 混成集積回路基板の製造方法 |
US4759965A (en) * | 1985-08-06 | 1988-07-26 | Canon Kabushiki Kaisha | Ceramic, preparation thereof and electronic circuit substrate by use thereof |
EP0218796B1 (en) * | 1985-08-16 | 1990-10-31 | Dai-Ichi Seiko Co. Ltd. | Semiconductor device comprising a plug-in-type package |
US5314788A (en) * | 1986-01-24 | 1994-05-24 | Canon Kabushiki Kaisha | Matrix printed board and process of forming the same |
FR2606559B1 (fr) * | 1986-11-12 | 1990-03-02 | Rech Digitales Sarl Et | Connecteur modulaire |
US5212352A (en) * | 1987-07-31 | 1993-05-18 | Texas Instruments Incorporated | Self-aligned tungsten-filled via |
JPH0812801B2 (ja) * | 1988-01-11 | 1996-02-07 | 株式会社日立製作所 | ハイブリットic用基板とそれを用いたハイブリットic及びその装置 |
US5073840A (en) * | 1988-10-06 | 1991-12-17 | Microlithics Corporation | Circuit board with coated metal support structure and method for making same |
US4870746A (en) * | 1988-11-07 | 1989-10-03 | Litton Systems, Inc. | Method of making a multilayer printed circuit board having screened-on resistors |
US5082804A (en) * | 1989-01-19 | 1992-01-21 | David Sarnoff Research Center, Inc. | Thick film copper via fill inks |
US5066620A (en) * | 1989-01-31 | 1991-11-19 | Asahi Glass Company Ltd. | Conductive paste compositions and ceramic substrates |
US4985376A (en) * | 1989-01-31 | 1991-01-15 | Asahi Glass Company, Ltd. | Conductive paste compositions and ceramic substrates |
JPH02265243A (ja) * | 1989-04-05 | 1990-10-30 | Nec Corp | 多層配線およびその形成方法 |
US5245136A (en) * | 1989-10-06 | 1993-09-14 | International Business Machines Corporation | Hermetic package for an electronic device |
JP2616515B2 (ja) * | 1991-06-26 | 1997-06-04 | 日本電気株式会社 | 厚膜抵抗体,厚膜印刷配線基板およびその製造方法ならびに厚膜混成集積回路 |
US5252382A (en) * | 1991-09-03 | 1993-10-12 | Cornell Research Foundation, Inc. | Interconnect structures having patterned interfaces to minimize stress migration and related electromigration damages |
DE69329357T2 (de) * | 1992-05-14 | 2001-04-26 | Matsushita Electric Industrial Co., Ltd. | Verfahren zur Herstellung von Leitern in Kontaktlöcher in vielschichtigen Keramiksubstraten |
US5338598A (en) * | 1992-12-14 | 1994-08-16 | Corning Incorporated | Sintered inorganic composites comprising co-sintered tape reinforcement |
US5439731A (en) * | 1994-03-11 | 1995-08-08 | Cornell Research Goundation, Inc. | Interconnect structures containing blocked segments to minimize stress migration and electromigration damage |
US5514451A (en) * | 1995-01-27 | 1996-05-07 | David Sarnoff Research Center, Inc. | Conductive via fill inks for ceramic multilayer circuit boards on support substrates |
JP3331083B2 (ja) * | 1995-03-06 | 2002-10-07 | 株式会社住友金属エレクトロデバイス | 低温焼成セラミック回路基板 |
US6208234B1 (en) * | 1998-04-29 | 2001-03-27 | Morton International | Resistors for electronic packaging |
RU2133081C1 (ru) * | 1998-12-08 | 1999-07-10 | Таран Александр Иванович | Многослойная коммутационная плата (варианты) |
DE19935677B4 (de) * | 1999-07-29 | 2005-07-07 | Robert Bosch Gmbh | Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten |
JP3387458B2 (ja) * | 1999-09-13 | 2003-03-17 | 株式会社村田製作所 | 絶縁体組成物、絶縁体ペーストおよび積層電子部品 |
US20050094465A1 (en) * | 2003-11-03 | 2005-05-05 | Netlist Inc. | Printed circuit board memory module with embedded passive components |
WO2005059945A1 (ja) * | 2003-12-16 | 2005-06-30 | Matsushita Electric Industrial Co., Ltd. | プラズマディスプレイパネル |
US7687137B2 (en) * | 2005-02-28 | 2010-03-30 | Kyocera Corporation | Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor |
US7294390B2 (en) * | 2005-04-21 | 2007-11-13 | Delphi Technologies, Inc. | Method for improving the thermal cycled adhesion of thick-film conductors on dielectric |
KR100896610B1 (ko) * | 2007-11-05 | 2009-05-08 | 삼성전기주식회사 | 다층 세라믹 기판 및 그 제조방법 |
US9648743B2 (en) * | 2011-12-16 | 2017-05-09 | Snaptrack, Inc. | Multilayer glass ceramic substrate with embedded resistor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3576668A (en) | 1968-06-07 | 1971-04-27 | United Aircraft Corp | Multilayer thick film ceramic hybrid integrated circuit |
US3878443A (en) | 1973-07-27 | 1975-04-15 | Gen Electric | Capacitor with glass bonded ceramic dielectric |
US4256796A (en) | 1979-11-05 | 1981-03-17 | Rca Corporation | Partially devitrified porcelain composition and articles prepared with same |
-
1980
- 1980-07-28 JP JP1980105728U patent/JPS5729185U/ja active Pending
-
1981
- 1981-07-28 US US06/287,683 patent/US4424251A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4424251A (en) | 1984-01-03 |