JPS5727094A - Semiconductor light emitting device - Google Patents
Semiconductor light emitting deviceInfo
- Publication number
- JPS5727094A JPS5727094A JP10226180A JP10226180A JPS5727094A JP S5727094 A JPS5727094 A JP S5727094A JP 10226180 A JP10226180 A JP 10226180A JP 10226180 A JP10226180 A JP 10226180A JP S5727094 A JPS5727094 A JP S5727094A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- light emitting
- current confining
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
Abstract
PURPOSE:To excellently monitor the light emitting state at the location adjacent to the light emitting region, by providing a current confining embeded layer between a semiconductor substrate and a heterogeneous junction structure. CONSTITUTION:On the N type GaAs substrate 11, is formed a P type reversely biased layer 12 (embeded layer) wherein the current confining part 12a is provided by removing the central part in a stripe shape. On said layer 12, is formed the heterogeneous junction structure 13 comprising a first clad layer 14 of N type GaAl As, a P type GaAs active layer 15, and a second clad layer 16 of P type GaAlAs. On the top of the second clad layer 16, is deposited an electrode 18 having a window 18a directly over the current confining part 12a via a P type ohmic contact layer 17. An electrode 19 is deposited on the entire bottom surface of the substrate 11.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10226180A JPS5727094A (en) | 1980-07-25 | 1980-07-25 | Semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10226180A JPS5727094A (en) | 1980-07-25 | 1980-07-25 | Semiconductor light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5727094A true JPS5727094A (en) | 1982-02-13 |
Family
ID=14322645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10226180A Pending JPS5727094A (en) | 1980-07-25 | 1980-07-25 | Semiconductor light emitting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5727094A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0833391A1 (en) * | 1996-09-27 | 1998-04-01 | Siemens Aktiengesellschaft | Semiconductor device on III-V semiconductor substrate and method for fabricating it |
-
1980
- 1980-07-25 JP JP10226180A patent/JPS5727094A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0833391A1 (en) * | 1996-09-27 | 1998-04-01 | Siemens Aktiengesellschaft | Semiconductor device on III-V semiconductor substrate and method for fabricating it |
US6339233B1 (en) | 1996-09-27 | 2002-01-15 | Siemens Aktiengesellschaft | Metal clad ridge waveguide (“MCRW”) laser semiconductor structure with doped semiconductor substrate |
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