JPS5727050A - Lead frame and semiconductor device using said lead frame - Google Patents

Lead frame and semiconductor device using said lead frame

Info

Publication number
JPS5727050A
JPS5727050A JP10113080A JP10113080A JPS5727050A JP S5727050 A JPS5727050 A JP S5727050A JP 10113080 A JP10113080 A JP 10113080A JP 10113080 A JP10113080 A JP 10113080A JP S5727050 A JPS5727050 A JP S5727050A
Authority
JP
Japan
Prior art keywords
lead frame
plated
semiconductor device
wires
sections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10113080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342859B2 (enrdf_load_stackoverflow
Inventor
Fumihito Inoue
Kazuo Shimizu
Susumu Okikawa
Hiromichi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10113080A priority Critical patent/JPS5727050A/ja
Publication of JPS5727050A publication Critical patent/JPS5727050A/ja
Publication of JPS6342859B2 publication Critical patent/JPS6342859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10113080A 1980-07-25 1980-07-25 Lead frame and semiconductor device using said lead frame Granted JPS5727050A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10113080A JPS5727050A (en) 1980-07-25 1980-07-25 Lead frame and semiconductor device using said lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10113080A JPS5727050A (en) 1980-07-25 1980-07-25 Lead frame and semiconductor device using said lead frame

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP20117189A Division JPH0284744A (ja) 1989-08-04 1989-08-04 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5727050A true JPS5727050A (en) 1982-02-13
JPS6342859B2 JPS6342859B2 (enrdf_load_stackoverflow) 1988-08-25

Family

ID=14292489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10113080A Granted JPS5727050A (en) 1980-07-25 1980-07-25 Lead frame and semiconductor device using said lead frame

Country Status (1)

Country Link
JP (1) JPS5727050A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593053A (ja) * 1982-06-29 1984-01-09 Sekisui Chem Co Ltd 積層ガラス
JPS596850U (ja) * 1982-07-06 1984-01-17 日本電気株式会社 半導体装置用リ−ドフレ−ム
JPS59133049A (ja) * 1983-01-21 1984-07-31 旭硝子株式会社 積層安全ガラスおよびその製造方法
JPS6113950U (ja) * 1984-06-29 1986-01-27 大日本印刷株式会社 金属部分被覆を施した半導体リ−ドフレ−ム
JPS61279698A (ja) * 1985-06-05 1986-12-10 Hitachi Cable Ltd 微少点状めつき部を有するリ−ドフレ−ムの製造方法
JPS6253832A (ja) * 1985-05-28 1987-03-09 旭硝子株式会社 積層体およびその製造方法
JPH02205062A (ja) * 1989-02-02 1990-08-14 Nec Kyushu Ltd リードフレーム
JP2010073830A (ja) * 2008-09-17 2010-04-02 Sumitomo Metal Mining Co Ltd リードフレーム及びリードフレームの製造方法
CN105336839A (zh) * 2015-11-16 2016-02-17 格力电器（合肥）有限公司 焊盘、发光二极管及焊盘印刷模板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278371A (en) * 1975-12-25 1977-07-01 Nec Corp Metal ribbon for semiconductor device
JPS52129465U (enrdf_load_stackoverflow) * 1976-03-26 1977-10-01
JPS553641A (en) * 1978-06-23 1980-01-11 Hitachi Ltd Lead frame
JPS554908A (en) * 1978-06-26 1980-01-14 Hitachi Ltd Lead frame

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278371A (en) * 1975-12-25 1977-07-01 Nec Corp Metal ribbon for semiconductor device
JPS52129465U (enrdf_load_stackoverflow) * 1976-03-26 1977-10-01
JPS553641A (en) * 1978-06-23 1980-01-11 Hitachi Ltd Lead frame
JPS554908A (en) * 1978-06-26 1980-01-14 Hitachi Ltd Lead frame

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS593053A (ja) * 1982-06-29 1984-01-09 Sekisui Chem Co Ltd 積層ガラス
JPS596850U (ja) * 1982-07-06 1984-01-17 日本電気株式会社 半導体装置用リ−ドフレ−ム
JPS59133049A (ja) * 1983-01-21 1984-07-31 旭硝子株式会社 積層安全ガラスおよびその製造方法
JPS6113950U (ja) * 1984-06-29 1986-01-27 大日本印刷株式会社 金属部分被覆を施した半導体リ−ドフレ−ム
JPS6253832A (ja) * 1985-05-28 1987-03-09 旭硝子株式会社 積層体およびその製造方法
JPS61279698A (ja) * 1985-06-05 1986-12-10 Hitachi Cable Ltd 微少点状めつき部を有するリ−ドフレ−ムの製造方法
JPH02205062A (ja) * 1989-02-02 1990-08-14 Nec Kyushu Ltd リードフレーム
JP2010073830A (ja) * 2008-09-17 2010-04-02 Sumitomo Metal Mining Co Ltd リードフレーム及びリードフレームの製造方法
CN105336839A (zh) * 2015-11-16 2016-02-17 格力电器（合肥）有限公司 焊盘、发光二极管及焊盘印刷模板

Also Published As

Publication number Publication date
JPS6342859B2 (enrdf_load_stackoverflow) 1988-08-25

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