JPS572544A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS572544A JPS572544A JP7554180A JP7554180A JPS572544A JP S572544 A JPS572544 A JP S572544A JP 7554180 A JP7554180 A JP 7554180A JP 7554180 A JP7554180 A JP 7554180A JP S572544 A JPS572544 A JP S572544A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- microminiaturization
- annealed
- emitted
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To enable the formation of an ultra LSI without loss in its microminiaturization property by annealing only desired part with a laser beam or an electron beam capable of locally heating, thereby smoothing the profile of an impurity distribution. CONSTITUTION:When the withstand voltage of an MOSFET is improved, a thick field oxidized film 2 and a thin gate oxidized film 6 are formed, and a polysilicon gate 3 is then formed. Then, impurity ions are injected to form a source region 5 and a drain region 4, the latter are annealed, a CW laser beam 7 is emitted only to the region 4 to anneal it, and a diffusion depth is thus deepened. Thus, the electric field concentration can be alleviated to improve the withstand voltage. When a wire is formed, a pulse laser beam 7 is emitted to regions 9, 10 to which arsenic ions are injected, thereby obtaining a low resistance wire 9. Since only desired part is annealed in this case, the microminiaturization property cannot be lost.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7554180A JPS572544A (en) | 1980-06-06 | 1980-06-06 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7554180A JPS572544A (en) | 1980-06-06 | 1980-06-06 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS572544A true JPS572544A (en) | 1982-01-07 |
Family
ID=13579159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7554180A Pending JPS572544A (en) | 1980-06-06 | 1980-06-06 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS572544A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5352354A (en) * | 1976-10-25 | 1978-05-12 | Hitachi Ltd | Semiconductor local heating method |
JPS5563818A (en) * | 1978-11-06 | 1980-05-14 | Nec Corp | Manufacture of semiconductor device |
-
1980
- 1980-06-06 JP JP7554180A patent/JPS572544A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5352354A (en) * | 1976-10-25 | 1978-05-12 | Hitachi Ltd | Semiconductor local heating method |
JPS5563818A (en) * | 1978-11-06 | 1980-05-14 | Nec Corp | Manufacture of semiconductor device |
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