JPS5724541A - Preparation of metal oxide semiconductor - Google Patents
Preparation of metal oxide semiconductorInfo
- Publication number
- JPS5724541A JPS5724541A JP9952780A JP9952780A JPS5724541A JP S5724541 A JPS5724541 A JP S5724541A JP 9952780 A JP9952780 A JP 9952780A JP 9952780 A JP9952780 A JP 9952780A JP S5724541 A JPS5724541 A JP S5724541A
- Authority
- JP
- Japan
- Prior art keywords
- dioxide
- thin
- film
- tantalum
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
PURPOSE:To increase specific permittivity and make an IC compact by a method wherein a thin film of non-fusible metal such as Ta, Hf and Zr is allowed to stick onto a dioxide film on a semiconductor substrate and then the substrate is heated to convert these films into a thin oxide film containing a semiconductor component and a metal component. CONSTITUTION:A thin tantalum film 34 which is 50-200Angstrom thick is attached by means of D.C. double-pole spattering onto a dioxide Si thin film 33 formed on a P type Si substrate 31 containing dioxide Si 32. Since a tantalum atom that is provided with kinetic energy can penetrate the dioxide Si thin films 32, 33 located as deep as 100Angstrom , the region of the thin film 33 becomes that of a mixture of dioxide Si and tantalum. This region is formed in the specified shape, before being treated with heat. Then the thin films 34, 33 are converted into an oxide 33' which is a mixture of tantalum and Si 500Angstrom thick. By so doing, this makes it possible to readily obtain a compact MOSFET transistor having a metal oxide thin film with a larger specific dielectric constant.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9952780A JPS5724541A (en) | 1980-07-21 | 1980-07-21 | Preparation of metal oxide semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9952780A JPS5724541A (en) | 1980-07-21 | 1980-07-21 | Preparation of metal oxide semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5724541A true JPS5724541A (en) | 1982-02-09 |
Family
ID=14249695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9952780A Pending JPS5724541A (en) | 1980-07-21 | 1980-07-21 | Preparation of metal oxide semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5724541A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3446643A1 (en) * | 1983-12-20 | 1985-06-27 | Mitsubishi Denki K.K., Tokio/Tokyo | METHOD FOR PRODUCING SEMICONDUCTOR ELEMENTS |
-
1980
- 1980-07-21 JP JP9952780A patent/JPS5724541A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3446643A1 (en) * | 1983-12-20 | 1985-06-27 | Mitsubishi Denki K.K., Tokio/Tokyo | METHOD FOR PRODUCING SEMICONDUCTOR ELEMENTS |
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