JPS5599721A - Preparation of semiconductor device - Google Patents

Preparation of semiconductor device

Info

Publication number
JPS5599721A
JPS5599721A JP798679A JP798679A JPS5599721A JP S5599721 A JPS5599721 A JP S5599721A JP 798679 A JP798679 A JP 798679A JP 798679 A JP798679 A JP 798679A JP S5599721 A JPS5599721 A JP S5599721A
Authority
JP
Japan
Prior art keywords
diffusion layer
aluminium
irradiating
metal
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP798679A
Other languages
Japanese (ja)
Inventor
Kunio Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP798679A priority Critical patent/JPS5599721A/en
Publication of JPS5599721A publication Critical patent/JPS5599721A/en
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To execute diffusion simply and under good controllability by coating metal on a silicon substrate and irradiating laser light from above this metal layer to diffuse metal into the substrate.
CONSTITUTION: On a region to make a diffusion layer on a silicon substrate 1, an opening of an insulating film 2 is formed and then aluminium 3 is coated. If laser light 4 is irradiated next, an aluminium diffusion layer 5 is formed. Removing the aluminium remaining on the surface next, a diffusion layer is formed. By selecting irradiating energy density or irradiating time appropriately at this time, the depth of a diffusion layer can be controlled freely.
COPYRIGHT: (C)1980,JPO&Japio
JP798679A 1979-01-25 1979-01-25 Preparation of semiconductor device Pending JPS5599721A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP798679A JPS5599721A (en) 1979-01-25 1979-01-25 Preparation of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP798679A JPS5599721A (en) 1979-01-25 1979-01-25 Preparation of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5599721A true JPS5599721A (en) 1980-07-30

Family

ID=11680742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP798679A Pending JPS5599721A (en) 1979-01-25 1979-01-25 Preparation of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5599721A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015179712A (en) * 2014-03-19 2015-10-08 新電元工業株式会社 Manufacturing method of mesa type semiconductor device, and mesa type semiconductor device
JP2016157911A (en) * 2015-02-25 2016-09-01 国立大学法人九州大学 Device for doping impurity, method for doping impurity, and method for manufacturing semiconductor element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015179712A (en) * 2014-03-19 2015-10-08 新電元工業株式会社 Manufacturing method of mesa type semiconductor device, and mesa type semiconductor device
JP2016157911A (en) * 2015-02-25 2016-09-01 国立大学法人九州大学 Device for doping impurity, method for doping impurity, and method for manufacturing semiconductor element

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