JPS5723284A - Manufacture of gan diode - Google Patents
Manufacture of gan diodeInfo
- Publication number
- JPS5723284A JPS5723284A JP9804580A JP9804580A JPS5723284A JP S5723284 A JPS5723284 A JP S5723284A JP 9804580 A JP9804580 A JP 9804580A JP 9804580 A JP9804580 A JP 9804580A JP S5723284 A JPS5723284 A JP S5723284A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- type
- region
- gan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/0037—Devices characterised by their operation having a MIS barrier layer
Abstract
PURPOSE:To obtain a monolithic type display device of high reproducibility and high accuracy by a method wherein is forming an MIS type GaN diode, the insulator layer is made to be a planer type one burried in the GaN surface. CONSTITUTION:A nondoped GaN crystal is epitaxially grown on a sapphire substrate 1 to obtain a GaN layer 2 showing N<+> type, and a GaN layer 3 which has been made to be N type by doping An is epitaxially grown laminatedly on the layer 2. Then, an SiO2 film 4 having a central lack part is formed on the layer 3, and Zn ions are injected using the film 4 as a mask to form an ion-implanted region 5 in the layer 3. The film 4 is removed, and a Zn ion non-transmittable film 6 having Si3N4 and the like is provided on the region 5. Then, the substrate 1 is heated in an NH3 atmosphere at about 1,000 deg.C for one hour to release Zn ions by out-diffusion process from the layer 3 not covered with film 6 and the form an N<+> type region 7. A negative electrode 9 is attached to the region 7, the film 6 is removed, and a positive electrode 8 is attached onto the exposed region 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9804580A JPS5723284A (en) | 1980-07-16 | 1980-07-16 | Manufacture of gan diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9804580A JPS5723284A (en) | 1980-07-16 | 1980-07-16 | Manufacture of gan diode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5723284A true JPS5723284A (en) | 1982-02-06 |
JPS6328358B2 JPS6328358B2 (en) | 1988-06-08 |
Family
ID=14209173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9804580A Granted JPS5723284A (en) | 1980-07-16 | 1980-07-16 | Manufacture of gan diode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5723284A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05183189A (en) * | 1991-11-08 | 1993-07-23 | Nichia Chem Ind Ltd | Manufacture of p-type gallium nitride based compound semiconductor |
-
1980
- 1980-07-16 JP JP9804580A patent/JPS5723284A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05183189A (en) * | 1991-11-08 | 1993-07-23 | Nichia Chem Ind Ltd | Manufacture of p-type gallium nitride based compound semiconductor |
Also Published As
Publication number | Publication date |
---|---|
JPS6328358B2 (en) | 1988-06-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5723284A (en) | Manufacture of gan diode | |
JPS5493378A (en) | Manufacture for semiconductor device | |
JPS56138920A (en) | Method of selection and diffusion for impurities | |
JPS5512754A (en) | Semiconductor device manufacturing method | |
JPS5688356A (en) | Manufacture of memory cell | |
JPS5460858A (en) | Manufacture of gallium arsenide crystal wafer | |
JPS56148823A (en) | Production of planer type semiconductor device | |
JPS6428809A (en) | Laser annealing device | |
JPS6419716A (en) | Manufacture of epitaxial growth wafer | |
JPS56115528A (en) | Manufacture of semiconductor device | |
JPS5633841A (en) | Manufacture of semiconductor device | |
JPS57118683A (en) | Manufacture of callium arsenide hall device | |
JPS55145373A (en) | Fabricating method of semiconductor device | |
JPS544580A (en) | Production of semiconductor devices | |
JPS543470A (en) | Etching method | |
JPS57173956A (en) | Manufacture of semiconductor device | |
JPS5660015A (en) | Manufacture of semiconductor device | |
JPS5515291A (en) | Manufacturing method for semiconductor device | |
JPS5380160A (en) | Manufacture of substrate for semiconductor device | |
JPS57170539A (en) | Manufacture of semiconductor device | |
JPS52128083A (en) | Manufacture of semiconductor device | |
JPS57194520A (en) | Manufacture of semiconductor device | |
JPS57143823A (en) | Fabrication of semiconductor device | |
JPS5565476A (en) | Manufacture of field effect transistor | |
JPS5773944A (en) | Production of semiconductor device |