JPS5721830A - Bonding wire for semiconductor element - Google Patents

Bonding wire for semiconductor element

Info

Publication number
JPS5721830A
JPS5721830A JP9609680A JP9609680A JPS5721830A JP S5721830 A JPS5721830 A JP S5721830A JP 9609680 A JP9609680 A JP 9609680A JP 9609680 A JP9609680 A JP 9609680A JP S5721830 A JPS5721830 A JP S5721830A
Authority
JP
Japan
Prior art keywords
wire
semiconductor element
bonding
bonding wire
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9609680A
Other languages
English (en)
Other versions
JPS6248373B2 (ja
Inventor
Norimasa Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP9609680A priority Critical patent/JPS5721830A/ja
Publication of JPS5721830A publication Critical patent/JPS5721830A/ja
Publication of JPS6248373B2 publication Critical patent/JPS6248373B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
JP9609680A 1980-07-14 1980-07-14 Bonding wire for semiconductor element Granted JPS5721830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9609680A JPS5721830A (en) 1980-07-14 1980-07-14 Bonding wire for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9609680A JPS5721830A (en) 1980-07-14 1980-07-14 Bonding wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5721830A true JPS5721830A (en) 1982-02-04
JPS6248373B2 JPS6248373B2 (ja) 1987-10-13

Family

ID=14155857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9609680A Granted JPS5721830A (en) 1980-07-14 1980-07-14 Bonding wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5721830A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161357A (ja) * 1984-08-31 1986-03-29 Jeol Ltd 電子線装置の走査回転装置
JPS61135457U (ja) * 1985-02-14 1986-08-23
JP2010167490A (ja) * 2009-01-23 2010-08-05 Junde Li 合金ワイヤの製造方法およびその製品
JP2014053610A (ja) * 2012-09-04 2014-03-20 Heraeus Materials Technology Gmbh & Co Kg ボンディング適用のための銀合金ワイヤ
CN114107724A (zh) * 2021-11-19 2022-03-01 江西蓝微电子科技有限公司 一种银合金键合丝及其制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63180072U (ja) * 1987-05-11 1988-11-21
MY162021A (en) * 2014-03-31 2017-05-31 Nippon Micrometal Corp Bonding wire for semiconductor device use and method of production of same
JP5840328B1 (ja) * 2014-03-31 2016-01-06 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161357A (ja) * 1984-08-31 1986-03-29 Jeol Ltd 電子線装置の走査回転装置
JPS61135457U (ja) * 1985-02-14 1986-08-23
JP2010167490A (ja) * 2009-01-23 2010-08-05 Junde Li 合金ワイヤの製造方法およびその製品
JP2014053610A (ja) * 2012-09-04 2014-03-20 Heraeus Materials Technology Gmbh & Co Kg ボンディング適用のための銀合金ワイヤ
CN114107724A (zh) * 2021-11-19 2022-03-01 江西蓝微电子科技有限公司 一种银合金键合丝及其制备方法

Also Published As

Publication number Publication date
JPS6248373B2 (ja) 1987-10-13

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