JPS5720437A - Resin sealing metal mold for semiconductor device - Google Patents

Resin sealing metal mold for semiconductor device

Info

Publication number
JPS5720437A
JPS5720437A JP9534180A JP9534180A JPS5720437A JP S5720437 A JPS5720437 A JP S5720437A JP 9534180 A JP9534180 A JP 9534180A JP 9534180 A JP9534180 A JP 9534180A JP S5720437 A JPS5720437 A JP S5720437A
Authority
JP
Japan
Prior art keywords
lead
resin
lower molds
burrs
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9534180A
Other languages
English (en)
Inventor
Yukio Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9534180A priority Critical patent/JPS5720437A/ja
Publication of JPS5720437A publication Critical patent/JPS5720437A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP9534180A 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device Pending JPS5720437A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9534180A JPS5720437A (en) 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9534180A JPS5720437A (en) 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5720437A true JPS5720437A (en) 1982-02-02

Family

ID=14134985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9534180A Pending JPS5720437A (en) 1980-07-10 1980-07-10 Resin sealing metal mold for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5720437A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210628A (ja) * 1982-05-31 1983-12-07 Toshiba Corp 半導体樹脂封止用金型
JPH0479936U (ja) * 1990-11-24 1992-07-13
US6410883B1 (en) * 1999-05-26 2002-06-25 Nec Corporation Cleaning device and method for cleaning resin sealing metal mold

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210628A (ja) * 1982-05-31 1983-12-07 Toshiba Corp 半導体樹脂封止用金型
JPH0479936U (ja) * 1990-11-24 1992-07-13
US6410883B1 (en) * 1999-05-26 2002-06-25 Nec Corporation Cleaning device and method for cleaning resin sealing metal mold

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