JPS5720436A - Method and device for improving flatness of polished wafer - Google Patents

Method and device for improving flatness of polished wafer

Info

Publication number
JPS5720436A
JPS5720436A JP4468681A JP4468681A JPS5720436A JP S5720436 A JPS5720436 A JP S5720436A JP 4468681 A JP4468681 A JP 4468681A JP 4468681 A JP4468681 A JP 4468681A JP S5720436 A JPS5720436 A JP S5720436A
Authority
JP
Japan
Prior art keywords
polished wafer
improving flatness
flatness
improving
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4468681A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0112631B2 (enExample
Inventor
Jieroomu Uorushiyu Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of JPS5720436A publication Critical patent/JPS5720436A/ja
Publication of JPH0112631B2 publication Critical patent/JPH0112631B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP4468681A 1980-03-27 1981-03-26 Method and device for improving flatness of polished wafer Granted JPS5720436A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/134,714 US4313284A (en) 1980-03-27 1980-03-27 Apparatus for improving flatness of polished wafers

Publications (2)

Publication Number Publication Date
JPS5720436A true JPS5720436A (en) 1982-02-02
JPH0112631B2 JPH0112631B2 (enExample) 1989-03-01

Family

ID=22464634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4468681A Granted JPS5720436A (en) 1980-03-27 1981-03-26 Method and device for improving flatness of polished wafer

Country Status (6)

Country Link
US (1) US4313284A (enExample)
JP (1) JPS5720436A (enExample)
KR (1) KR840002114B1 (enExample)
DE (1) DE3112019A1 (enExample)
GB (1) GB2072550B (enExample)
IT (1) IT1137514B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63114874A (ja) * 1986-05-16 1988-05-19 サイベック　システムズ ウエハを処理するためのアセンブリ
JPS6458474A (en) * 1987-08-26 1989-03-06 Speedfam Co Ltd Pressure head for surface grinding device
JPH01135464A (ja) * 1987-11-16 1989-05-29 Mitsubishi Metal Corp 研磨装置
JPH01159171A (ja) * 1987-12-15 1989-06-22 Toshiba Corp 研磨定盤
JP2012176843A (ja) * 2011-02-28 2012-09-13 Akim Kk 部品搬送装置
CN105437076A (zh) * 2014-08-27 2016-03-30 中芯国际集成电路制造(上海)有限公司 晶片轮廓实时控制方法和系统

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US4811522A (en) * 1987-03-23 1989-03-14 Gill Jr Gerald L Counterbalanced polishing apparatus
US5357716A (en) * 1988-10-20 1994-10-25 Olympus Optical Company Limited Holding device for holding optical element to be ground
US5399528A (en) * 1989-06-01 1995-03-21 Leibovitz; Jacques Multi-layer fabrication in integrated circuit systems
US5291692A (en) * 1989-09-14 1994-03-08 Olympus Optical Company Limited Polishing work holder
US5127196A (en) * 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate
US5104828A (en) * 1990-03-01 1992-04-14 Intel Corporation Method of planarizing a dielectric formed over a semiconductor substrate
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
GB9008531D0 (en) * 1990-04-17 1990-06-13 Logitech Ltd Monitoring and control of surface curvature
USRE36890E (en) * 1990-07-31 2000-10-03 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
FR2677293A1 (fr) * 1991-06-06 1992-12-11 Commissariat Energie Atomique Machine de polissage a tete support de plaquettes perfectionnee.
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
EP0579298B1 (en) * 1992-06-15 1997-09-03 Koninklijke Philips Electronics N.V. Method of manufacturing a plate having a plane main surface, method of manufacturing a plate having parallel main surfaces, and device suitable for implementing said methods
TW227540B (enExample) * 1992-06-15 1994-08-01 Philips Electronics Nv
JP2655975B2 (ja) * 1992-09-18 1997-09-24 三菱マテリアル株式会社 ウェーハ研磨装置
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5435772A (en) * 1993-04-30 1995-07-25 Motorola, Inc. Method of polishing a semiconductor substrate
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5605487A (en) * 1994-05-13 1997-02-25 Memc Electric Materials, Inc. Semiconductor wafer polishing appartus and method
US5607341A (en) * 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5651724A (en) * 1994-09-08 1997-07-29 Ebara Corporation Method and apparatus for polishing workpiece
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5658185A (en) * 1995-10-25 1997-08-19 International Business Machines Corporation Chemical-mechanical polishing apparatus with slurry removal system and method
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
JPH10235552A (ja) * 1997-02-24 1998-09-08 Ebara Corp ポリッシング装置
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US5885135A (en) * 1997-04-23 1999-03-23 International Business Machines Corporation CMP wafer carrier for preferential polishing of a wafer
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
US6113479A (en) * 1997-07-25 2000-09-05 Obsidian, Inc. Wafer carrier for chemical mechanical planarization polishing
US6116990A (en) * 1997-07-25 2000-09-12 Applied Materials, Inc. Adjustable low profile gimbal system for chemical mechanical polishing
US5931719A (en) * 1997-08-25 1999-08-03 Lsi Logic Corporation Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
US5975998A (en) * 1997-09-26 1999-11-02 Memc Electronic Materials , Inc. Wafer processing apparatus
US5948699A (en) * 1997-11-21 1999-09-07 Sibond, L.L.C. Wafer backing insert for free mount semiconductor polishing apparatus and process
US6531397B1 (en) 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6129610A (en) * 1998-08-14 2000-10-10 International Business Machines Corporation Polish pressure modulation in CMP to preferentially polish raised features
US6187681B1 (en) * 1998-10-14 2001-02-13 Micron Technology, Inc. Method and apparatus for planarization of a substrate
JP3537688B2 (ja) * 1998-11-24 2004-06-14 富士通株式会社 磁気ヘッドの加工方法
DE60128768T2 (de) * 2000-01-31 2007-10-11 Shin-Etsu Handotai Co., Ltd. Polierverfahren und vorrichtung
US6446948B1 (en) 2000-03-27 2002-09-10 International Business Machines Corporation Vacuum chuck for reducing distortion of semiconductor and GMR head wafers during processing
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6488565B1 (en) 2000-08-29 2002-12-03 Applied Materials, Inc. Apparatus for chemical mechanical planarization having nested load cups
US6755723B1 (en) 2000-09-29 2004-06-29 Lam Research Corporation Polishing head assembly
DE10054159A1 (de) * 2000-11-02 2002-05-16 Wacker Siltronic Halbleitermat Verfahren zur Montage von Halbleiterscheiben
US6394886B1 (en) * 2001-10-10 2002-05-28 Taiwan Semiconductor Manufacturing Company, Ltd Conformal disk holder for CMP pad conditioner
US7214548B2 (en) * 2004-08-30 2007-05-08 International Business Machines Corporation Apparatus and method for flattening a warped substrate
JP4902433B2 (ja) * 2007-06-13 2012-03-21 株式会社荏原製作所 研磨装置の研磨面加熱、冷却装置
JP5038259B2 (ja) * 2008-08-26 2012-10-03 株式会社日立ハイテクノロジーズ クリーニング装置およびクリーニング方法
US20100112905A1 (en) * 2008-10-30 2010-05-06 Leonard Borucki Wafer head template for chemical mechanical polishing and a method for its use
JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
JP6592355B2 (ja) 2015-01-30 2019-10-16 株式会社荏原製作所 連結機構および基板研磨装置
JP6376085B2 (ja) * 2015-09-03 2018-08-22 信越半導体株式会社 研磨方法及び研磨装置
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
DE102020125246A1 (de) * 2020-09-28 2022-03-31 Lapmaster Wolters Gmbh Doppel- oder Einseiten-Bearbeitungsmaschine
CN118366915B (zh) * 2024-05-14 2024-12-06 山东有研艾斯半导体材料有限公司 一种改善晶圆单面抛光后表面形貌及表面平整度的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2241478A (en) * 1940-04-17 1941-05-13 Joseph F Remington Skiving machine
US2405417A (en) * 1943-07-09 1946-08-06 Galvin Mfg Corp Apparatus for grinding the surfaces of small objects
US2869294A (en) * 1957-07-02 1959-01-20 Abrading Systems Company Lapping machine
US3170273A (en) * 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US3475867A (en) * 1966-12-20 1969-11-04 Monsanto Co Processing of semiconductor wafers
US3611654A (en) * 1969-09-30 1971-10-12 Alliance Tool & Die Corp Polishing machine or similar abrading apparatus
FR2097216A5 (enExample) * 1970-05-27 1972-03-03 Anvar
US3747282A (en) * 1971-11-29 1973-07-24 E Katzke Apparatus for polishing wafers
US3977130A (en) * 1975-05-12 1976-08-31 Semimetals, Inc. Removal-compensating polishing apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63114874A (ja) * 1986-05-16 1988-05-19 サイベック　システムズ ウエハを処理するためのアセンブリ
JPS6458474A (en) * 1987-08-26 1989-03-06 Speedfam Co Ltd Pressure head for surface grinding device
JPH01135464A (ja) * 1987-11-16 1989-05-29 Mitsubishi Metal Corp 研磨装置
JPH01159171A (ja) * 1987-12-15 1989-06-22 Toshiba Corp 研磨定盤
JP2012176843A (ja) * 2011-02-28 2012-09-13 Akim Kk 部品搬送装置
CN105437076A (zh) * 2014-08-27 2016-03-30 中芯国际集成电路制造(上海)有限公司 晶片轮廓实时控制方法和系统

Also Published As

Publication number Publication date
GB2072550A (en) 1981-10-07
JPH0112631B2 (enExample) 1989-03-01
DE3112019C2 (enExample) 1992-06-11
KR840002114B1 (ko) 1984-11-15
US4313284A (en) 1982-02-02
GB2072550B (en) 1983-07-27
DE3112019A1 (de) 1982-01-28
KR830005718A (ko) 1983-09-09
IT8120742A0 (it) 1981-03-26
IT1137514B (it) 1986-09-10

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