JPS57201074A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPS57201074A
JPS57201074A JP8644481A JP8644481A JPS57201074A JP S57201074 A JPS57201074 A JP S57201074A JP 8644481 A JP8644481 A JP 8644481A JP 8644481 A JP8644481 A JP 8644481A JP S57201074 A JPS57201074 A JP S57201074A
Authority
JP
Japan
Prior art keywords
film
oxidized
substrate
oxidized film
interval
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8644481A
Other languages
Japanese (ja)
Inventor
Takeya Ezaki
Masabumi Kubota
Osamu Ishikawa
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8644481A priority Critical patent/JPS57201074A/en
Publication of JPS57201074A publication Critical patent/JPS57201074A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE:To obtain an ultrafine semiconductor device in which distances between diffused layers and between metal wires less than the minimum size of a photoetching method and a method of manufacturing the same by providing a groove formed on the surface of an oxidized film particularly at the side of a semiconductor film and of a substrate and the insulating film directly uhder the oxidized film of the side surface. CONSTITUTION:A nitrided film 15 and polysilicon 14 are selectively photolithographically removed on a silicon substrate 11, the side surface of the formed polysilicon 14a is oxidized, thereby growing an oxidized film or the like. Subsequently, the surface of the surface exposed from the substrate 11 by medicine treatment is etched in the deisired depth, forming parallel grooves 17a, and an oxdized film 18'a is allowed to remain on the side surface of the groove. The steps further continue, but the pitch P between the bases becomes a half as compared with the conventional method in the width and interval of the polysilicons 14a, 14b, 14c, and the interval between the metal electrodes 22 and 23 is defined by the oxidized film 16, thereby reducing smaller than the minimum size of the photolithographic removal.
JP8644481A 1981-06-04 1981-06-04 Semiconductor device and manufacture thereof Pending JPS57201074A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8644481A JPS57201074A (en) 1981-06-04 1981-06-04 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8644481A JPS57201074A (en) 1981-06-04 1981-06-04 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS57201074A true JPS57201074A (en) 1982-12-09

Family

ID=13887083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8644481A Pending JPS57201074A (en) 1981-06-04 1981-06-04 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57201074A (en)

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