JPS57198649A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57198649A JPS57198649A JP56085221A JP8522181A JPS57198649A JP S57198649 A JPS57198649 A JP S57198649A JP 56085221 A JP56085221 A JP 56085221A JP 8522181 A JP8522181 A JP 8522181A JP S57198649 A JPS57198649 A JP S57198649A
- Authority
- JP
- Japan
- Prior art keywords
- elements
- package
- refrigerant
- cavity
- porous substances
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W40/73—
-
- H10W72/5449—
-
- H10W72/884—
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56085221A JPS57198649A (en) | 1981-05-30 | 1981-05-30 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56085221A JPS57198649A (en) | 1981-05-30 | 1981-05-30 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57198649A true JPS57198649A (en) | 1982-12-06 |
| JPS6161704B2 JPS6161704B2 (enExample) | 1986-12-26 |
Family
ID=13852505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56085221A Granted JPS57198649A (en) | 1981-05-30 | 1981-05-30 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57198649A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989070A (en) * | 1988-11-10 | 1991-01-29 | Coriolis Corporation | Modular heat sink structure |
| US5187565A (en) * | 1991-03-18 | 1993-02-16 | Mitsubishi Denki Kabushiki Kaisha | Liquid sealed semiconductor device and method of assembling the same |
-
1981
- 1981-05-30 JP JP56085221A patent/JPS57198649A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989070A (en) * | 1988-11-10 | 1991-01-29 | Coriolis Corporation | Modular heat sink structure |
| US5187565A (en) * | 1991-03-18 | 1993-02-16 | Mitsubishi Denki Kabushiki Kaisha | Liquid sealed semiconductor device and method of assembling the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6161704B2 (enExample) | 1986-12-26 |
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