JPS54111281A - Resin seal forming mold of semiconductor device - Google Patents
Resin seal forming mold of semiconductor deviceInfo
- Publication number
- JPS54111281A JPS54111281A JP1886178A JP1886178A JPS54111281A JP S54111281 A JPS54111281 A JP S54111281A JP 1886178 A JP1886178 A JP 1886178A JP 1886178 A JP1886178 A JP 1886178A JP S54111281 A JPS54111281 A JP S54111281A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- heat sink
- resin
- lower mold
- metallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To prevent resin from adhering to a heat sink by providing a adsorption means, which adsorbs resin, on the wall face, where the heat sink of a resin seal forming seal forming mold is brought into contact, through gum packing.
CONSTITUTION: IC element 5 is fixed to heat sink 4, and heat sink 4 is put on gum packing 15 is lower mold 9b while one end 1a of conductive stripe 2 connected to element 5 is protruded outside a metallic mold. Next, upper mold 9a is put on lower mold 9b to seal element 5 hermetically, and the metallic mold is heated at a prescribed temperature, and vacuum suction entrance 13 provided in lower mold 9b is used to make the inside of the metallic mold vacuum. After that, high-pressure resin 10 is injected into space part 9c in the metallic mold, and vacuum adsorption is released to open upper mold 9a and lower mold 9b after a prescribed time, and compressed air is sent from suction entrance 13 to remove element 5 from the metallic mold. As a result, the interval between lower face 4b of heat sink 4 and internal bottom face 9d of lower mold 9b can be made several μm, and resin can be prevented from invading this interval.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1886178A JPS54111281A (en) | 1978-02-20 | 1978-02-20 | Resin seal forming mold of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1886178A JPS54111281A (en) | 1978-02-20 | 1978-02-20 | Resin seal forming mold of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54111281A true JPS54111281A (en) | 1979-08-31 |
JPS5625779B2 JPS5625779B2 (en) | 1981-06-15 |
Family
ID=11983313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1886178A Granted JPS54111281A (en) | 1978-02-20 | 1978-02-20 | Resin seal forming mold of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54111281A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998002919A1 (en) * | 1996-07-12 | 1998-01-22 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5397370A (en) * | 1977-02-07 | 1978-08-25 | Toshiba Corp | Trasfer mold device for semiconductor device |
-
1978
- 1978-02-20 JP JP1886178A patent/JPS54111281A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5397370A (en) * | 1977-02-07 | 1978-08-25 | Toshiba Corp | Trasfer mold device for semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998002919A1 (en) * | 1996-07-12 | 1998-01-22 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device |
US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
Also Published As
Publication number | Publication date |
---|---|
JPS5625779B2 (en) | 1981-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5435679A (en) | Semiconductor connection method | |
JPS54111281A (en) | Resin seal forming mold of semiconductor device | |
JPS5372456A (en) | Glass sealing semiconductor device | |
JPS53108369A (en) | Electronic components | |
JPS5433665A (en) | Manufacture for resin sealed type semiconductor device and resin sealed metal mold | |
JPS546169A (en) | Production of insulative pannel | |
JPS5559745A (en) | Semiconductor device | |
JPS537173A (en) | Solder-sealed ceramic package | |
JPS5514286A (en) | Sulfurizing metallic mold for recovery tire | |
JPS51126068A (en) | Manufacturing method of semi-conductor equipment | |
SE8107881L (en) | DEVICE FOR CLASSIFICATION OF AN ELECTRIC CONDENSOR IN A HEARDABLE RESIN | |
JPS5385160A (en) | Production of semiconductor device | |
JPS5432155A (en) | Thermo compression bonding apparatus | |
JPS5460564A (en) | Resin mold semiconductor device | |
JPS5449070A (en) | Container for semiconductor device | |
JPS5210676A (en) | Semiconductor device | |
JPS5591837A (en) | Manufacture of electronic device | |
JPS5269577A (en) | Composite semiconductor device | |
JPS5418675A (en) | Sealing method for semiconductor element | |
JPS52132671A (en) | Enclosing method of mercury for discharge tube | |
JPS5515265A (en) | Collet for assembling semiconductor device | |
JPS54128275A (en) | Package for semiconductor device | |
JPS5476062A (en) | Manufactre of semiconductor device | |
JPS5394769A (en) | Manufacture of semiconductor device | |
JPS5320860A (en) | Hermetic sealing method of electronic parts |