JPS5269577A - Composite semiconductor device - Google Patents

Composite semiconductor device

Info

Publication number
JPS5269577A
JPS5269577A JP14509875A JP14509875A JPS5269577A JP S5269577 A JPS5269577 A JP S5269577A JP 14509875 A JP14509875 A JP 14509875A JP 14509875 A JP14509875 A JP 14509875A JP S5269577 A JPS5269577 A JP S5269577A
Authority
JP
Japan
Prior art keywords
semiconductor device
composite semiconductor
hollw
high voltage
element connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14509875A
Other languages
Japanese (ja)
Inventor
Kenzo Shima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14509875A priority Critical patent/JPS5269577A/en
Publication of JPS5269577A publication Critical patent/JPS5269577A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: The hollw cooling body is mounted into resin formation body which molds unit commutator element connected mutually. In this method, a composite semiconductor device which can increase the heat discharge effect suitable for high voltage diode used for electronic range, etc. can be obtained.
COPYRIGHT: (C)1977,JPO&Japio
JP14509875A 1975-12-08 1975-12-08 Composite semiconductor device Pending JPS5269577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14509875A JPS5269577A (en) 1975-12-08 1975-12-08 Composite semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14509875A JPS5269577A (en) 1975-12-08 1975-12-08 Composite semiconductor device

Publications (1)

Publication Number Publication Date
JPS5269577A true JPS5269577A (en) 1977-06-09

Family

ID=15377315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14509875A Pending JPS5269577A (en) 1975-12-08 1975-12-08 Composite semiconductor device

Country Status (1)

Country Link
JP (1) JPS5269577A (en)

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