JPS5559745A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5559745A JPS5559745A JP13361378A JP13361378A JPS5559745A JP S5559745 A JPS5559745 A JP S5559745A JP 13361378 A JP13361378 A JP 13361378A JP 13361378 A JP13361378 A JP 13361378A JP S5559745 A JPS5559745 A JP S5559745A
- Authority
- JP
- Japan
- Prior art keywords
- wall
- substrate
- chip
- resin
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To improve reliability, by simplifying sealing work and by bettering airtight properties by installing a wall for surrounding a semiconductor chip mounted to a mounting substrate and a wall for enclosing the substrate to a cap for housing the semiconductor chip and by filling resin between both walls.
CONSTITUTION: A semiconductor chip 3 is fixed to a mounting substrate 2 in ceramics, etc. provided with connecting-pins 1 and wiring. A cap 7 is prepared which is equipped with the first wall 8 surrounding the chip 3 and the second wall 9 enclosing the substrate in a shape that is higher than the wall 8 only by the thickness of the substrate and is integrally formed with cemarics or metal, and half- hardening or liquefied resin 10 is filled to a void between the first and second walls. The substrate to which the chip 3 is fixed is turned upside down and inserted into the cap, and the resin is hardened by heat treatment. The resin does not flow into space that there is no chip because air around the chip surrounded by means of the first wall 8 expands and is pushed out from a clearance between the wall and the substrate when heat treatment.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53133613A JPS5837694B2 (en) | 1978-10-30 | 1978-10-30 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP53133613A JPS5837694B2 (en) | 1978-10-30 | 1978-10-30 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5559745A true JPS5559745A (en) | 1980-05-06 |
| JPS5837694B2 JPS5837694B2 (en) | 1983-08-18 |
Family
ID=15108896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP53133613A Expired JPS5837694B2 (en) | 1978-10-30 | 1978-10-30 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837694B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58120659U (en) * | 1982-02-12 | 1983-08-17 | 株式会社日立製作所 | Hybrid integrated circuit package |
| JPS6332952A (en) * | 1986-07-25 | 1988-02-12 | Nec Corp | Package for hybrid ic |
| US5585669A (en) * | 1991-06-17 | 1996-12-17 | U.S. Philips Corporation | Semiconductor chip card having selective encapsulation |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6111772U (en) * | 1984-06-25 | 1986-01-23 | 株式会社日立国際電気 | Resistance heating element support structure in single crystal pulling growth equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113372U (en) * | 1978-01-26 | 1979-08-09 |
-
1978
- 1978-10-30 JP JP53133613A patent/JPS5837694B2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113372U (en) * | 1978-01-26 | 1979-08-09 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58120659U (en) * | 1982-02-12 | 1983-08-17 | 株式会社日立製作所 | Hybrid integrated circuit package |
| JPS6332952A (en) * | 1986-07-25 | 1988-02-12 | Nec Corp | Package for hybrid ic |
| US5585669A (en) * | 1991-06-17 | 1996-12-17 | U.S. Philips Corporation | Semiconductor chip card having selective encapsulation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5837694B2 (en) | 1983-08-18 |
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