JPS54159864A - Storing package of semiconductor wafer - Google Patents

Storing package of semiconductor wafer

Info

Publication number
JPS54159864A
JPS54159864A JP6947678A JP6947678A JPS54159864A JP S54159864 A JPS54159864 A JP S54159864A JP 6947678 A JP6947678 A JP 6947678A JP 6947678 A JP6947678 A JP 6947678A JP S54159864 A JPS54159864 A JP S54159864A
Authority
JP
Japan
Prior art keywords
wafer
plastic film
concave
taper
vinyl chloride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6947678A
Other languages
Japanese (ja)
Other versions
JPS6146970B2 (en
Inventor
Yoshiaki Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6947678A priority Critical patent/JPS54159864A/en
Publication of JPS54159864A publication Critical patent/JPS54159864A/en
Publication of JPS6146970B2 publication Critical patent/JPS6146970B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)

Abstract

PURPOSE: To offer advantage to handling, transfer and keeping of wafers to hold quality and reliability by storing wafers in a package containing inactive gas.
CONSTITUTION: Wafer 1 is put on aluminum foil 2 faceup, and hard plastic film 4 such as a vinyl chloride film having a concave whose volume is equal to that of the wafer approximately is put on the wafer. Then, the surface of the aluminum foil in the space part where the wafer is not put and the flat part of the vinyl chloride film are subjected to thermal compression bonding in an inactive gas atmosphere and are sealed hermetrically. At this time, a taper is provided on the side face of the concave of the plastic film so that the hard plastic film inside wall and the wafer surface may be prevented from being brought into contact with each other. As a result, the taper on the concave side face functions of fix the wafer and the wafer surface is always placed in space even is the stored wafer is vibrated in carriage.
COPYRIGHT: (C)1979,JPO&Japio
JP6947678A 1978-06-08 1978-06-08 Storing package of semiconductor wafer Granted JPS54159864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6947678A JPS54159864A (en) 1978-06-08 1978-06-08 Storing package of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6947678A JPS54159864A (en) 1978-06-08 1978-06-08 Storing package of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS54159864A true JPS54159864A (en) 1979-12-18
JPS6146970B2 JPS6146970B2 (en) 1986-10-16

Family

ID=13403768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6947678A Granted JPS54159864A (en) 1978-06-08 1978-06-08 Storing package of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS54159864A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611149U (en) * 1984-06-09 1986-01-07 株式会社 堀場製作所 Filter element pack for automobile exhaust gas analyzer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413718A (en) * 1987-07-08 1989-01-18 Sumitomo Electric Industries Method for storing semiconductor substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933185U (en) * 1972-06-23 1974-03-23
JPS5017330U (en) * 1973-06-11 1975-02-25
JPS5443461A (en) * 1977-09-12 1979-04-06 Sumitomo Electric Ind Ltd Packing method of semiconductor wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933185U (en) * 1972-06-23 1974-03-23
JPS5017330U (en) * 1973-06-11 1975-02-25
JPS5443461A (en) * 1977-09-12 1979-04-06 Sumitomo Electric Ind Ltd Packing method of semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611149U (en) * 1984-06-09 1986-01-07 株式会社 堀場製作所 Filter element pack for automobile exhaust gas analyzer

Also Published As

Publication number Publication date
JPS6146970B2 (en) 1986-10-16

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