JPS57194523A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57194523A
JPS57194523A JP7960181A JP7960181A JPS57194523A JP S57194523 A JPS57194523 A JP S57194523A JP 7960181 A JP7960181 A JP 7960181A JP 7960181 A JP7960181 A JP 7960181A JP S57194523 A JPS57194523 A JP S57194523A
Authority
JP
Japan
Prior art keywords
sio2 film
impurity
foreign matters
aperture
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7960181A
Other languages
Japanese (ja)
Inventor
Takuya Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7960181A priority Critical patent/JPS57194523A/en
Publication of JPS57194523A publication Critical patent/JPS57194523A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To eliminate foreign matters such as resistor material by a method wherein an insulation film is formed on an exposed part formed by an aperture drilling process of a semiconductor substrate and only the insulation film at the part where an impurity diffusion layer is formd is removed. CONSTITUTION:An SiO2 film 12 is formd on a silicon-substrate 11 and an aperture is drilled for diffusion of impurity. An SiO2 film 12' is formed on the semiconductor substrate by exposure. The SiO2 film 12' in the diffusion aperture is completely removed by etching. Then glass material which contains impurity such as arsenic silicate glass is applied by spinning-coated. A spin-on-glass layer 13 is formed by thermal treatment and an impurity diffusion layer 14 is formed by thermal treatment and the spin-on-glass layer 13 is removed. With this constitution, even if foreign matters 15 such as resistor material is remained, those foreign matters 15 is taken into the SiO2 film 12' and removed with the SiO2 film by etching.
JP7960181A 1981-05-26 1981-05-26 Manufacture of semiconductor device Pending JPS57194523A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7960181A JPS57194523A (en) 1981-05-26 1981-05-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7960181A JPS57194523A (en) 1981-05-26 1981-05-26 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57194523A true JPS57194523A (en) 1982-11-30

Family

ID=13694524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7960181A Pending JPS57194523A (en) 1981-05-26 1981-05-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57194523A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196936A (en) * 1984-03-21 1985-10-05 Seiko Epson Corp Manufacture of semiconductor device
JPH02312A (en) * 1989-02-13 1990-01-05 Seiko Epson Corp Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60196936A (en) * 1984-03-21 1985-10-05 Seiko Epson Corp Manufacture of semiconductor device
JPH02312A (en) * 1989-02-13 1990-01-05 Seiko Epson Corp Manufacture of semiconductor device

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