JPS57193065A - Insulated gate field effect transistor - Google Patents
Insulated gate field effect transistorInfo
- Publication number
- JPS57193065A JPS57193065A JP7851181A JP7851181A JPS57193065A JP S57193065 A JPS57193065 A JP S57193065A JP 7851181 A JP7851181 A JP 7851181A JP 7851181 A JP7851181 A JP 7851181A JP S57193065 A JPS57193065 A JP S57193065A
- Authority
- JP
- Japan
- Prior art keywords
- field effect
- effect transistor
- layer
- insulated gate
- gate field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005669 field effect Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Abstract
PURPOSE:To decrease a threshold voltage of an enhancement type IGFET without applying any operation to the parameter except the length of an inverted layer by forming a depletion layer between a drain part and a source part in a range that is not coupled directly between the drain part and the source part. CONSTITUTION:A drain part 2 and a source part 3 are diffused at the prescribed interval on the surface side of an Si substrate 1, a gate 4 formed of a gate oxidized film 6 and a gate electrode 7 disposed on the film 6 is formed on the surface of a substrate 1 between the part 2 and the part 3, thereby forming an enhancement type IGFET. In this structure, a depletion layer 5 is formed shallower than he parts 2, 3 in a range that is not coupled directly from the end of the part 2 to the end of the part 3. At this time, the layer 5 may be extended from either end toward the center, or may be provided at the intermediate between the ends. In this manner, a threshold voltage is lowered, thereby decreasing the power consumption.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7851181A JPS57193065A (en) | 1981-05-22 | 1981-05-22 | Insulated gate field effect transistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7851181A JPS57193065A (en) | 1981-05-22 | 1981-05-22 | Insulated gate field effect transistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57193065A true JPS57193065A (en) | 1982-11-27 |
Family
ID=13663957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7851181A Pending JPS57193065A (en) | 1981-05-22 | 1981-05-22 | Insulated gate field effect transistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57193065A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989012910A1 (en) * | 1988-06-23 | 1989-12-28 | Dallas Semiconductor Corporation | Enclosed buried channel transistor |
US4943537A (en) * | 1988-06-23 | 1990-07-24 | Dallas Semiconductor Corporation | CMOS integrated circuit with reduced susceptibility to PMOS punchthrough |
US5122474A (en) * | 1988-06-23 | 1992-06-16 | Dallas Semiconductor Corporation | Method of fabricating a CMOS IC with reduced susceptibility to PMOS punchthrough |
-
1981
- 1981-05-22 JP JP7851181A patent/JPS57193065A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989012910A1 (en) * | 1988-06-23 | 1989-12-28 | Dallas Semiconductor Corporation | Enclosed buried channel transistor |
US4906588A (en) * | 1988-06-23 | 1990-03-06 | Dallas Semiconductor Corporation | Enclosed buried channel transistor |
US4943537A (en) * | 1988-06-23 | 1990-07-24 | Dallas Semiconductor Corporation | CMOS integrated circuit with reduced susceptibility to PMOS punchthrough |
US5122474A (en) * | 1988-06-23 | 1992-06-16 | Dallas Semiconductor Corporation | Method of fabricating a CMOS IC with reduced susceptibility to PMOS punchthrough |
US5688722A (en) * | 1988-06-23 | 1997-11-18 | Dallas Semiconductor Corporation | CMOS integrated circuit with reduced susceptibility to PMOS punchthrough |
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