JPS57186346A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57186346A JPS57186346A JP56071657A JP7165781A JPS57186346A JP S57186346 A JPS57186346 A JP S57186346A JP 56071657 A JP56071657 A JP 56071657A JP 7165781 A JP7165781 A JP 7165781A JP S57186346 A JPS57186346 A JP S57186346A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- resin
- supporters
- disarrangement
- leakage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011347 resin Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 229920000728 polyester Chemical group 0.000 abstract 2
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229950011008 tetrachloroethylene Drugs 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49558—Insulating layers on lead frames, e.g. bridging members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56071657A JPS57186346A (en) | 1981-05-12 | 1981-05-12 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56071657A JPS57186346A (en) | 1981-05-12 | 1981-05-12 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57186346A true JPS57186346A (en) | 1982-11-16 |
| JPS6160575B2 JPS6160575B2 (enrdf_load_stackoverflow) | 1986-12-22 |
Family
ID=13466892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56071657A Granted JPS57186346A (en) | 1981-05-12 | 1981-05-12 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57186346A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6413735A (en) * | 1987-03-19 | 1989-01-18 | Texas Instruments Inc | Method of mounting semiconductor device and mounted semiconductor device |
-
1981
- 1981-05-12 JP JP56071657A patent/JPS57186346A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6413735A (en) * | 1987-03-19 | 1989-01-18 | Texas Instruments Inc | Method of mounting semiconductor device and mounted semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6160575B2 (enrdf_load_stackoverflow) | 1986-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS55111151A (en) | Integrated circuit device | |
| JPS6436496A (en) | Carrier element incorporated into identification card | |
| SG82590A1 (en) | Bumpless flip chip assembly with strips and via-fill | |
| JPS5769765A (en) | Sealed body of semiconductor device | |
| US3494023A (en) | Method of producing semiconductor integrated circuits | |
| JPS57186346A (en) | Manufacture of semiconductor device | |
| JPH0669636A (ja) | 部品装着構造と部品装着方法 | |
| JPS5277684A (en) | Exeternal wiring of integrated circuit | |
| JPS6411354A (en) | Sealing structure of electronic circuit | |
| JPS5277587A (en) | Wiring of integrated circuit outside chip | |
| JPS55138241A (en) | Sealing structure for semiconductor device | |
| JPS551153A (en) | Semiconductor fitting device | |
| JPS5546561A (en) | Method of fabricating hybrid integrated circuit | |
| JPS55138240A (en) | Manufacture of semiconductor device | |
| JPS5552248A (en) | Manufacture of electronic device | |
| JPS5567154A (en) | Method of installing lead-less ic package | |
| JPS5524478A (en) | Integrated circuit | |
| JPS5718348A (en) | Integrated circuit device | |
| JPH0263145A (ja) | 樹脂封止型半導体装置 | |
| JPS5587461A (en) | Microwave integrated circuit package | |
| JPS6444027A (en) | Semiconductor device | |
| RU1251749C (ru) | Способ изготовления полупроводниковых приборов с объемными выводами | |
| JPS5561044A (en) | Packaging device for semiconductor integrated circuit | |
| JPS54153586A (en) | Semiconductor device | |
| JPS6436055A (en) | Method of sealing electronic component |