JPS57185350A - Curable resin composition - Google Patents
Curable resin compositionInfo
- Publication number
- JPS57185350A JPS57185350A JP7038181A JP7038181A JPS57185350A JP S57185350 A JPS57185350 A JP S57185350A JP 7038181 A JP7038181 A JP 7038181A JP 7038181 A JP7038181 A JP 7038181A JP S57185350 A JPS57185350 A JP S57185350A
- Authority
- JP
- Japan
- Prior art keywords
- polyfunctional
- reinforcing material
- polyphenylene ether
- unsaturated double
- ether resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 2
- 229920001955 polyphenylene ether Polymers 0.000 abstract 2
- 239000007870 radical polymerization initiator Substances 0.000 abstract 2
- 239000012779 reinforcing material Substances 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229920001169 thermoplastic Polymers 0.000 abstract 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 125000000962 organic group Chemical group 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000002685 polymerization catalyst Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038181A JPS57185350A (en) | 1981-05-11 | 1981-05-11 | Curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7038181A JPS57185350A (en) | 1981-05-11 | 1981-05-11 | Curable resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57185350A true JPS57185350A (en) | 1982-11-15 |
| JPH0153298B2 JPH0153298B2 (enrdf_load_stackoverflow) | 1989-11-13 |
Family
ID=13429801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7038181A Granted JPS57185350A (en) | 1981-05-11 | 1981-05-11 | Curable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57185350A (enrdf_load_stackoverflow) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287959A (ja) * | 1985-06-15 | 1986-12-18 | Matsushita Electric Works Ltd | ポリフエニレンオキサイド系硬化物の製法 |
| JPH01158039A (ja) * | 1987-04-27 | 1989-06-21 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
| US5929168A (en) * | 1994-05-19 | 1999-07-27 | Optatech, Corporation | Polyphenylene ether blends and a process for the preparation thereof |
| JP2002003752A (ja) * | 2000-06-21 | 2002-01-09 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
| US6492030B1 (en) | 1999-02-03 | 2002-12-10 | Tomoegawa Paper Co., Ltd. | Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same |
| JP2007302876A (ja) * | 2006-04-13 | 2007-11-22 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP2007302877A (ja) * | 2006-04-14 | 2007-11-22 | Hitachi Chem Co Ltd | Ｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP2008095061A (ja) * | 2006-02-17 | 2008-04-24 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP2008133414A (ja) * | 2006-10-24 | 2008-06-12 | Hitachi Chem Co Ltd | 新規なセミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP2008291214A (ja) * | 2007-04-25 | 2008-12-04 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| US8501870B2 (en) | 2006-02-17 | 2013-08-06 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| WO2016138760A1 (zh) * | 2015-03-04 | 2016-09-09 | 广东生益科技股份有限公司 | 一种树脂组合物以及使用它的预浸料和层压板 |
| WO2016138759A1 (zh) * | 2015-03-05 | 2016-09-09 | 广东生益科技股份有限公司 | 一种树脂组合物以及使用它的预浸料和层压板 |
| WO2019230943A1 (ja) * | 2018-06-01 | 2019-12-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
-
1981
- 1981-05-11 JP JP7038181A patent/JPS57185350A/ja active Granted
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287959A (ja) * | 1985-06-15 | 1986-12-18 | Matsushita Electric Works Ltd | ポリフエニレンオキサイド系硬化物の製法 |
| JPH01158039A (ja) * | 1987-04-27 | 1989-06-21 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
| US5929168A (en) * | 1994-05-19 | 1999-07-27 | Optatech, Corporation | Polyphenylene ether blends and a process for the preparation thereof |
| US6492030B1 (en) | 1999-02-03 | 2002-12-10 | Tomoegawa Paper Co., Ltd. | Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same |
| JP2002003752A (ja) * | 2000-06-21 | 2002-01-09 | Jsr Corp | 膜形成用組成物および絶縁膜形成用材料 |
| US8501870B2 (en) | 2006-02-17 | 2013-08-06 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| JP2008095061A (ja) * | 2006-02-17 | 2008-04-24 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| US8568891B2 (en) | 2006-02-17 | 2013-10-29 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same |
| JP2007302876A (ja) * | 2006-04-13 | 2007-11-22 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP2007302877A (ja) * | 2006-04-14 | 2007-11-22 | Hitachi Chem Co Ltd | Ｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP2008133414A (ja) * | 2006-10-24 | 2008-06-12 | Hitachi Chem Co Ltd | 新規なセミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| JP2008291214A (ja) * | 2007-04-25 | 2008-12-04 | Hitachi Chem Co Ltd | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| WO2016138760A1 (zh) * | 2015-03-04 | 2016-09-09 | 广东生益科技股份有限公司 | 一种树脂组合物以及使用它的预浸料和层压板 |
| US10858514B2 (en) | 2015-03-04 | 2020-12-08 | Shengyi Technology Co., Ltd. | Resin composition and pre-preg and laminate using the composition |
| WO2016138759A1 (zh) * | 2015-03-05 | 2016-09-09 | 广东生益科技股份有限公司 | 一种树脂组合物以及使用它的预浸料和层压板 |
| US10584222B2 (en) | 2015-03-05 | 2020-03-10 | Shengyi Technology Co., Ltd. | Resin composition and pre-preg and laminate using the composition |
| WO2019230943A1 (ja) * | 2018-06-01 | 2019-12-05 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
| JP6669320B1 (ja) * | 2018-06-01 | 2020-03-18 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0153298B2 (enrdf_load_stackoverflow) | 1989-11-13 |
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