JPS57185173A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS57185173A JPS57185173A JP6931581A JP6931581A JPS57185173A JP S57185173 A JPS57185173 A JP S57185173A JP 6931581 A JP6931581 A JP 6931581A JP 6931581 A JP6931581 A JP 6931581A JP S57185173 A JPS57185173 A JP S57185173A
- Authority
- JP
- Japan
- Prior art keywords
- heating body
- thermal paper
- plate
- polyimide film
- convexed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
PURPOSE:To improve the transfer rate of heat to thermal paper by using a system in which a polyimide film insulation plate is laminated on a cooling plate having a convexed portion in its portion touched by the thermal paper in such a way as to project the convexed portion on the surface of the thermal head. CONSTITUTION:A polyimide film insulation base plate 7 and a resistor heating body 8 are orderly provided on the surface of a cooling plate 6 made of aluminum plate, etc., having a convexed portion in its portion touched by a thermal paper, having excellent corrosion reistance and excellent heat conductivity. The resistor heating body 8 is made of a electroless Ni-based alloy plating, e.g., of Ni-P, Ni-B, Ni-W-P alloys. A power supplying body 9 for the resitor heating body 8 is formed by crystallizing out Ni, Cu, or Au by electrolytic method, and covered with a wear-resistant layer 10 formed by an alumina-based coating agent serving to prevent the oxidation of the heating body 8.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6931581A JPS57185173A (en) | 1981-05-11 | 1981-05-11 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6931581A JPS57185173A (en) | 1981-05-11 | 1981-05-11 | Thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57185173A true JPS57185173A (en) | 1982-11-15 |
JPS6160778B2 JPS6160778B2 (en) | 1986-12-22 |
Family
ID=13398993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6931581A Granted JPS57185173A (en) | 1981-05-11 | 1981-05-11 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57185173A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6041249U (en) * | 1983-08-27 | 1985-03-23 | アルプス電気株式会社 | thermal head |
JPS6046245U (en) * | 1983-09-09 | 1985-04-01 | アルプス電気株式会社 | thermal head |
JPS6112357A (en) * | 1984-06-29 | 1986-01-20 | Hitachi Ltd | Thermal recording head |
JPS61270167A (en) * | 1985-05-27 | 1986-11-29 | Oki Electric Ind Co Ltd | Manufacture of protuberant form thermal head |
JPS61270166A (en) * | 1985-05-27 | 1986-11-29 | Oki Electric Ind Co Ltd | Manufacture of protuberant form thermal head |
JPS63189254A (en) * | 1987-01-31 | 1988-08-04 | Toshiba Corp | Thermal head |
JPH021337A (en) * | 1987-12-14 | 1990-01-05 | Xerox Corp | Thermal transfer printer |
JPH02286247A (en) * | 1989-04-26 | 1990-11-26 | Ricoh Co Ltd | Liquid jet recording device |
JPH02295748A (en) * | 1989-05-09 | 1990-12-06 | Ricoh Co Ltd | Liquid jet recorder |
-
1981
- 1981-05-11 JP JP6931581A patent/JPS57185173A/en active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6041249U (en) * | 1983-08-27 | 1985-03-23 | アルプス電気株式会社 | thermal head |
JPH0237563Y2 (en) * | 1983-08-27 | 1990-10-11 | ||
JPS6046245U (en) * | 1983-09-09 | 1985-04-01 | アルプス電気株式会社 | thermal head |
JPS6112357A (en) * | 1984-06-29 | 1986-01-20 | Hitachi Ltd | Thermal recording head |
JPH0579509B2 (en) * | 1984-06-29 | 1993-11-02 | Hitachi Ltd | |
JPH0479308B2 (en) * | 1985-05-27 | 1992-12-15 | Oki Electric Ind Co Ltd | |
JPS61270167A (en) * | 1985-05-27 | 1986-11-29 | Oki Electric Ind Co Ltd | Manufacture of protuberant form thermal head |
JPS61270166A (en) * | 1985-05-27 | 1986-11-29 | Oki Electric Ind Co Ltd | Manufacture of protuberant form thermal head |
JPH0479309B2 (en) * | 1985-05-27 | 1992-12-15 | Oki Electric Ind Co Ltd | |
JPS63189254A (en) * | 1987-01-31 | 1988-08-04 | Toshiba Corp | Thermal head |
JPH021337A (en) * | 1987-12-14 | 1990-01-05 | Xerox Corp | Thermal transfer printer |
JPH02286247A (en) * | 1989-04-26 | 1990-11-26 | Ricoh Co Ltd | Liquid jet recording device |
JPH02295748A (en) * | 1989-05-09 | 1990-12-06 | Ricoh Co Ltd | Liquid jet recorder |
Also Published As
Publication number | Publication date |
---|---|
JPS6160778B2 (en) | 1986-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57185173A (en) | Thermal head | |
BR8506214A (en) | PROCESS TO PREPARE HIGH TEMPERATURE RESISTANT MATERIALS | |
GB1497489A (en) | Boiling heat transfer process | |
EP0261078A1 (en) | Process for selectively forming at least one metal or alloy coating strip on a substrate of another metal and integrated circuit lead frame achieved by this process | |
JPS574781A (en) | Thin film type thermal head | |
JPS5767195A (en) | Surface treated steel plate with high corrision resistance | |
JPS57120664A (en) | Formation of nickel film | |
JPS5521513A (en) | Immersion plating method of lead or lead alloy on casting | |
JPS575856A (en) | Plating method | |
JPS56163294A (en) | Semibright palladium plating bath | |
JPS53129156A (en) | Plating method for carbonaceous powder | |
JP2000087293A (en) | Base sheet for electronic apparatus made of nickel plating aluminum base composite material and its production | |
JPS5716197A (en) | Platinum group metal plated body | |
GB2008490A (en) | Printed circuit substrate with resistance coat | |
JPS52107227A (en) | Heat resisting cu alloy with excellent electro- and heat conductivity | |
JPS52146177A (en) | Preparation of semiconductor device | |
JPS51119539A (en) | Heat exchanger | |
JPS57210991A (en) | Manufacture of surface-treated steel plate with high corrosion resistance | |
JPS5472676A (en) | Lead frame having alloy intermediate layer | |
JPS5732850A (en) | Mold for continouos casting | |
JPS57140884A (en) | Plating method for silver | |
JPS5387242A (en) | Thin film type thermal heads | |
JPS5620159A (en) | Surface treatment with corrosion resistant metallic film | |
JPS57188964A (en) | Manufacture of solar heat absorbing body | |
JPS6439794A (en) | Resin adhesive copper foil, printed wiring board using resin adhesive copper foil and film carrier for semiconductor device |