JPS6112357A - Thermal recording head - Google Patents

Thermal recording head

Info

Publication number
JPS6112357A
JPS6112357A JP13313584A JP13313584A JPS6112357A JP S6112357 A JPS6112357 A JP S6112357A JP 13313584 A JP13313584 A JP 13313584A JP 13313584 A JP13313584 A JP 13313584A JP S6112357 A JPS6112357 A JP S6112357A
Authority
JP
Japan
Prior art keywords
heat
resistor
layer
insulating layer
heat resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13313584A
Other languages
Japanese (ja)
Other versions
JPH0579509B2 (en
Inventor
Tatsuya Nagata
達也 永田
Michihiro Watanabe
渡辺　道弘
Kazutaka Satou
和恭 佐藤
Yasunori Narizuka
康則 成塚
Hidekazu Hara
英一 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13313584A priority Critical patent/JPS6112357A/en
Publication of JPS6112357A publication Critical patent/JPS6112357A/en
Publication of JPH0579509B2 publication Critical patent/JPH0579509B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To attain to enhance the stability and heat resistance of a resistor, by providing a heat resistant layer comprising insulating ceramic having high heat stability between a resistor and a heat resistant resin. CONSTITUTION:A heat insulating layer 2 comprising a heat resistant resin is provided on a substrate 1. A heat resistant layer 3 comprising insulating ceramic is provided on this heat insulating layer 2, and a conductor 5 and a protective layer 6 are further povided on a resistor 4. As the heat resistant resin used in the heat insulating layer 2, a material having high dissociation temp. and excellent heat resistance such as aromatic polyamide, polyimide, polysulfone or polyphenylene oxide is advantageous. By providing this heat resistant layer comprising ceramic, the diffusion of elements such as oxygen, nitrogen, carbon, hydrogen or sulfur constituting the heat insulating layer 2 to the resistor is prevented and the stability of a resistance value is enhanced.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はファクシミリ等の印画に使用する感熱記録ヘッ
ドに関し、特に抵抗体寿命、耐熱性に優れた感熱記録ヘ
ッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a thermal recording head used for printing in facsimiles and the like, and particularly to a thermal recording head that has excellent resistor life and heat resistance.

〔発明の背景〕[Background of the invention]

従来の感熱記録ヘッドは例えば特開昭５２−１００２４
５号公報に開示されているように、熱絶縁層に熱伝導率
の小さいエポキシまたは芳香族ポリイミド等の樹脂を用
いて、熱効率、熱応答特性を良好にするものが知られて
いる。しかし、この技術は、抵抗体の安定性、耐熱強度
の点には配慮されていなかった。A conventional thermal recording head is, for example, disclosed in Japanese Patent Application Laid-Open No. 52-10024.
As disclosed in Japanese Patent No. 5, it is known to improve thermal efficiency and thermal response characteristics by using a resin such as epoxy or aromatic polyimide having low thermal conductivity in the thermal insulating layer. However, this technology did not take into account the stability and heat resistance of the resistor.

〔発明の目的〕　５ 本発明の目的は、抵抗体の安定性、耐熱性の優れた高信
頼性の感熱記録ヘッドを提供することにある。[Object of the Invention] 5. An object of the present invention is to provide a highly reliable thermal recording head with excellent resistance and heat resistance.

〔発明の概要〕[Summary of the invention]

本発明の感熱記録ヘッドは、抵抗体と耐熱性樹脂で形成
した熱絶縁層の間に熱安定性の高い絶縁性セラミックよ
り成る耐熱層を設は抵抗体への不純物混入を防止し、抵
抗体に加わる熱応力を低下させたことを特徴とする。In the thermal recording head of the present invention, a heat-resistant layer made of insulating ceramic with high thermal stability is provided between the resistor and the heat-insulating layer made of heat-resistant resin to prevent impurities from entering the resistor. It is characterized by reducing the thermal stress applied to it.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の感熱記録ヘッドの一実施例を、第１図に
より説明する。基板１の上には、′耐熱性樹脂による熱
絶縁層２が設けられている。この熱絶縁層２の上には、
絶縁性セラミックによる耐熱層３が設けられ、その上に
形成される抵抗体４と前述の熱絶縁層２が接しないよう
にしている。更に、この抵抗体４の上には導体５．保護
層６が設けである。熱絶縁層２に用いる耐熱性樹脂には
、芳香族ポリアミド、ポリイミド、ポリスルホン。An embodiment of the thermal recording head of the present invention will be described below with reference to FIG. A heat insulating layer 2 made of a heat-resistant resin is provided on the substrate 1. On this thermal insulation layer 2,
A heat-resistant layer 3 made of insulating ceramic is provided so that the resistor 4 formed thereon does not come into contact with the aforementioned heat-insulating layer 2. Furthermore, a conductor 5 is placed on top of this resistor 4. A protective layer 6 is provided. The heat-resistant resin used for the thermal insulation layer 2 includes aromatic polyamide, polyimide, and polysulfone.

ポリフェニレンオキシド等の解離温度の高い耐熱性の優
れた材料が有利である。耐熱層３には保護層６と同様な
材料が一般に用いることが可能である。例えば５ｉｎ７
，５ｉａＮ４．ＳｉＣ等が有利であり、抵抗体４の材料
に適した密着性の良好な、そしてち密な絶縁性セラミッ
クが好ましい。このような構成をとることにより、抵抗
体４と熱絶縁層２は直接触れることがなくなる。熱絶縁
層２を構成する酸素、窒素、炭素、水素、硫黄などの元
素は、一部遊離し、抵抗体の抵抗値変動を引き起こす可
能性がある。しかし、セラミックによる耐熱層を設ける
ことにより、抵抗体への拡散を防止することができるの
で、寿命、抵抗値の安定性が向上する効果がある。Materials with high dissociation temperature and excellent heat resistance, such as polyphenylene oxide, are advantageous. The same material as the protective layer 6 can generally be used for the heat-resistant layer 3. For example 5in7
, 5iaN4. SiC or the like is advantageous, and a dense insulating ceramic with good adhesion and suitable for the material of the resistor 4 is preferable. By adopting such a configuration, the resistor 4 and the thermal insulation layer 2 do not come into direct contact with each other. Some of the elements constituting the thermal insulating layer 2, such as oxygen, nitrogen, carbon, hydrogen, and sulfur, may be liberated and cause a change in the resistance value of the resistor. However, by providing a ceramic heat-resistant layer, it is possible to prevent diffusion into the resistor, which has the effect of improving the life span and stability of the resistance value.

セラミックの熱膨張率は一般に０．２Ｘ１０−’１／℃
〜１０　Ｘ　１０−’１／℃と小さいのに対して、樹Ｊ
Ｉｔａ？’Ｌｔ、１．５　Ｘ　１０−’１／　℃〜８　
Ｘ　１０−’１／’Ｃと大きな値を示す。抵抗体の多く
は高比抵抗値を持つセラミック製であり、樹脂と積層す
ると直接熱応力が抵抗体に加わる。しかし、その間にセ
ラミック製の耐熱層を設けると熱応力の大きな部分は耐
熱層が負担することになり、抵抗体への熱応力が低減で
きるので抵抗体の耐熱性を向上できる効果がある。The coefficient of thermal expansion of ceramic is generally 0.2X10-'1/℃
〜10×10−′1/℃, whereas the tree J
Ita? 'Lt, 1.5 X 10-'1/℃~8
It shows a large value of X 10-'1/'C. Most resistors are made of ceramic with a high specific resistance value, and when laminated with resin, direct thermal stress is applied to the resistor. However, if a ceramic heat-resistant layer is provided between them, the heat-resistant layer will bear the bulk of the thermal stress, and the thermal stress on the resistor can be reduced, which has the effect of improving the heat resistance of the resistor.

セラミック耐熱層３は薄いほど熱容量が小さくなり熱効
率が良いが、拡散防止および熱応力の負担に必要な厚さ
から１〜５μｍが好ましい。The thinner the ceramic heat-resistant layer 3, the smaller the heat capacity and the better the thermal efficiency, but the thickness is preferably 1 to 5 μm in view of the thickness required to prevent diffusion and bear thermal stress.

別の実施例を第２図と第３図に示す。第２図は耐熱層３
を発熱部の付近にのみに形成した実施例であり、第３図
は熱絶縁層２を発熱部の付近のみに形成した実施例であ
る。これらの実施例は第１図に示した実施例の効果の他
に、印画媒体との接触が良好となる効果がある。Another embodiment is shown in FIGS. 2 and 3. Figure 2 shows heat-resistant layer 3.
This is an embodiment in which the thermal insulating layer 2 is formed only in the vicinity of the heat generating part, and FIG. 3 shows an embodiment in which the thermal insulating layer 2 is formed only in the vicinity of the heat generating part. In addition to the effect of the embodiment shown in FIG. 1, these embodiments have the effect of improving contact with the printing medium.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、熱絶縁層からの抵抗体への不純物拡散
を防止でき、さらに熱応力、を低減できるので抵抗体の
安定性を増し、耐熱性を向上する効果がある。According to the present invention, impurity diffusion from the heat insulating layer to the resistor can be prevented, and thermal stress can be reduced, so that the stability of the resistor can be increased and the heat resistance can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の感熱記録ヘッドの一実施例を示す概略
断面図、第２図および第３図は本発明の感熱記録ヘッド
の他の実施例を示す概略断面図である。 １・・・基板、２・・・熱絶縁層、３・・・耐熱層、４
・・・抵抗体、５・・・導体、６・・・保護層。FIG. 1 is a schematic sectional view showing one embodiment of the thermal recording head of the present invention, and FIGS. 2 and 3 are schematic sectional views showing other embodiments of the thermal recording head of the present invention. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Heat insulating layer, 3... Heat resistant layer, 4
...Resistor, 5...Conductor, 6...Protective layer.

Claims (1)

【特許請求の範囲】[Claims] １、基板と、基板の上に設けた熱絶縁層と、この熱絶縁
層上に設けた通電することにより発熱する抵抗体と、こ
の抵抗体に電力を供給する導体と、前記抵抗体と導体上
に形成した保護層とよりなる感熱記録ヘッドにおいて、
前記熱絶縁層と抵抗体の間に耐熱層を設けたことを特徴
とする感熱記録ヘッド。1. A substrate, a thermally insulating layer provided on the substrate, a resistor that generates heat when energized and provided on the thermally insulating layer, a conductor that supplies power to this resistor, and the resistor and conductor. In a thermal recording head consisting of a protective layer formed on top,
A heat-sensitive recording head characterized in that a heat-resistant layer is provided between the heat-insulating layer and the resistor.
JP13313584A 1984-06-29 1984-06-29 Thermal recording head Granted JPS6112357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13313584A JPS6112357A (en) 1984-06-29 1984-06-29 Thermal recording head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13313584A JPS6112357A (en) 1984-06-29 1984-06-29 Thermal recording head

Publications (2)

Publication Number Publication Date
JPS6112357A true JPS6112357A (en) 1986-01-20
JPH0579509B2 JPH0579509B2 (en) 1993-11-02

Family

ID=15097584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13313584A Granted JPS6112357A (en) 1984-06-29 1984-06-29 Thermal recording head

Country Status (1)

Country Link
JP (1) JPS6112357A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377752A (en) * 1986-09-19 1988-04-07 Fujitsu Ltd Thermal head
JPH01154770A (en) * 1987-12-11 1989-06-16 Toshiba Corp Thermal head
JPH021339A (en) * 1988-03-28 1990-01-05 Toshiba Corp Heat-resistant insulation substrate, thermal head and heat sensitive recording device
US5252988A (en) * 1989-12-15 1993-10-12 Sharp Kabushiki Kaisha Thermal head for thermal recording machine
US5444475A (en) * 1992-07-03 1995-08-22 Hitachi Koki Co., Ltd. Thermal recording head

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892032A (en) * 1972-02-29 1973-11-29
JPS52100245A (en) * 1976-02-19 1977-08-23 Oki Electric Ind Co Ltd Thermal head of high heat efficiency
JPS5440128U (en) * 1977-08-24 1979-03-16
JPS5455449A (en) * 1977-10-13 1979-05-02 Canon Inc Thermal head for thermal recorder
JPS5521276A (en) * 1978-08-02 1980-02-15 Tdk Corp Thermal head
JPS5783475A (en) * 1980-11-13 1982-05-25 Seiko Epson Corp Thermal head
JPS57185173A (en) * 1981-05-11 1982-11-15 Oki Electric Ind Co Ltd Thermal head
JPS60255459A (en) * 1984-06-01 1985-12-17 Ricoh Co Ltd Thermal head

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5440128B2 (en) * 1974-04-23 1979-12-01

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4892032A (en) * 1972-02-29 1973-11-29
JPS52100245A (en) * 1976-02-19 1977-08-23 Oki Electric Ind Co Ltd Thermal head of high heat efficiency
JPS5440128U (en) * 1977-08-24 1979-03-16
JPS5455449A (en) * 1977-10-13 1979-05-02 Canon Inc Thermal head for thermal recorder
JPS5521276A (en) * 1978-08-02 1980-02-15 Tdk Corp Thermal head
JPS5783475A (en) * 1980-11-13 1982-05-25 Seiko Epson Corp Thermal head
JPS57185173A (en) * 1981-05-11 1982-11-15 Oki Electric Ind Co Ltd Thermal head
JPS60255459A (en) * 1984-06-01 1985-12-17 Ricoh Co Ltd Thermal head

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377752A (en) * 1986-09-19 1988-04-07 Fujitsu Ltd Thermal head
JPH01154770A (en) * 1987-12-11 1989-06-16 Toshiba Corp Thermal head
JPH021339A (en) * 1988-03-28 1990-01-05 Toshiba Corp Heat-resistant insulation substrate, thermal head and heat sensitive recording device
JPH0575590B2 (en) * 1988-03-28 1993-10-20 Tokyo Shibaura Electric Co
US5252988A (en) * 1989-12-15 1993-10-12 Sharp Kabushiki Kaisha Thermal head for thermal recording machine
US5444475A (en) * 1992-07-03 1995-08-22 Hitachi Koki Co., Ltd. Thermal recording head

Also Published As

Publication number Publication date
JPH0579509B2 (en) 1993-11-02

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