JPS61270167A - Manufacture of protuberant form thermal head - Google Patents
Manufacture of protuberant form thermal headInfo
- Publication number
- JPS61270167A JPS61270167A JP60112030A JP11203085A JPS61270167A JP S61270167 A JPS61270167 A JP S61270167A JP 60112030 A JP60112030 A JP 60112030A JP 11203085 A JP11203085 A JP 11203085A JP S61270167 A JPS61270167 A JP S61270167A
- Authority
- JP
- Japan
- Prior art keywords
- film
- resist
- layer
- flexible film
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electronic Switches (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、感熱式プリンタに使用される凸形サーマル
ヘッドの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a convex thermal head used in a thermal printer.
（従来の技術）
従来、抵抗層の成膜方法に無電解めっきを用いた凸形サ
ー七ルヘッドの製造方法として、可撓性フィルム上にサ
ー冑ルヘッドを形成し、それを凸状保持体に貼り付けて
凸形サーマルヘッドを作製する方法がある。(Prior art) Conventionally, as a method for manufacturing a convex circular head using electroless plating as a method for forming a resistive layer, a circular head is formed on a flexible film, and then it is attached to a convex holder. There is a method of pasting it to create a convex thermal head.
（発明が解決しようとする問題点）
しかるに、このような方法では、可撓性フィルム上にあ
らかじめ抵抗層、配線層および保護膜を形成した後、そ
のフィルムを変形させるため、抵抗層の一部からなる発
熱体およびその上の保護膜にマイクロクラックなどを生
じやすく、信頼性を損ねる原因となっている。(Problems to be Solved by the Invention) However, in such a method, a resistance layer, a wiring layer, and a protective film are formed on a flexible film in advance, and then the film is deformed. Microcracks are likely to occur in the heating element and the protective film thereon, which impairs reliability.
（問題点を解決するための手段）
そこで、この発明では、可撓性フィルム上のめつき析出
のためのＰｄ （パラジウム）をホトリソダラフイによ
シバターン部にのみ残す工程まで実施した状態で、可撓
性フィルムを凸形形状の保持体に貼り付け、その後、貼
り付けた状態で無電解めっきによる抵抗層の形成、さら
には配腿層、保護膜の形成を行うｅ
（作用）
このような方法によれば、可撓性フィルムを保持体に貼
り付けた後（変形させた後）、抵抗層。(Means for Solving the Problems) Therefore, in the present invention, the process of leaving Pd (palladium) for plating deposition on a flexible film only on the shiba turn part by photolithography is carried out, and A resistive film is attached to a convex-shaped holder, and then, in the attached state, a resistance layer is formed by electroless plating, and a thigh layer and a protective film are formed. According to, after pasting (deforming) the flexible film on the holder, a resistive layer is formed.
配線層および保護膜の形成を行うので、発熱体および保
護膜にマイクロクラックが生じることはないＯ
（実施例）
以下この発明の一実施例を第１図を参照して説明する。Since the wiring layer and the protective film are formed, microcracks will not occur in the heating element and the protective film. (Embodiment) An embodiment of the present invention will be described below with reference to FIG. 1.
まず、第１図（ａ）に示す可撓性フィルム１上にめっき
析出に充分な量のＰｄを付与する。次に、との可撓性フ
ィルムｌに対してホトリソグラフィ（レジストプロセス
）を行い、パターン部（配線部と発熱体部）のＰｄをレ
ジストで覆う。しかる後、王水（塩酸３：硝酸ｌ）、硝
酸、熱濃硫酸あるいはよう素・よう化カリウム系溶液（
例えばＫＩ２：ＫＣｊ’ｌ ： １．２ ：純水１０溶
液）などを用いて前記レジストをマスクとしてＰｄのエ
ツチング（ホトリソグラフィのエツチングプロセス）を
行う。これによシ、 Ｐｄは、可撓性フィルムｌ上のパ
ターン部にのみ残る。このエツチング後、マスクとして
用いたレジストは除去される◎
次に、上記のようにしてパターン部にのみＰｄを残した
可撓性フィルムｌを第１図（ｂ）で示すように凸形の保
持体２に接着剤を用いて貼り付ける。First, a sufficient amount of Pd for plating precipitation is applied onto the flexible film 1 shown in FIG. 1(a). Next, photolithography (resist process) is performed on the flexible film 1, and the Pd in the pattern portion (wiring portion and heating element portion) is covered with resist. After that, add aqua regia (3 parts hydrochloric acid to 1 part nitric acid), nitric acid, hot concentrated sulfuric acid, or an iodine/potassium iodide solution (
For example, using the resist as a mask, Pd is etched (photolithography etching process) using KI2:KCj'l:1.2:10 solution of pure water. As a result, Pd remains only in the pattern area on the flexible film l. After this etching, the resist used as a mask is removed ◎ Next, the flexible film l with Pd left only in the pattern area is held in a convex shape as shown in Figure 1(b). Attach to body 2 using adhesive.
その後、無電解めっきを施す・すると・可撓性フィルム
ｌ上のパターン部のＰｄ上にめっき析出が生じて、そこ
に第１図（ｃ）に示すように抵抗層３が形成される。Thereafter, electroless plating is performed, whereby plating precipitation occurs on the Pd in the patterned portions of the flexible film 1, and a resistance layer 3 is formed thereon as shown in FIG. 1(c).
しかる後、抵抗層３の発熱体となる部分を印刷法あるい
はめつきテープのはシつけ等によシ覆う。Thereafter, the portion of the resistance layer 3 that will become the heating element is covered by a printing method or by applying plating tape.
その後、電気めっきを施すことによシ、前記第１図（Ｃ
）に示すように、抵抗層３上に発熱体となる部分を除い
て配線層４を形成する。Thereafter, by applying electroplating, the above-mentioned FIG. 1 (C
), a wiring layer 4 is formed on the resistance layer 3 except for a portion that will become a heating element.
しかる後、レジストを除去する。その後、前記Ｖシスト
除去によｐ露出した抵抗層３の発熱体となる部分に、そ
の部分を例えば治具で選択してスパッタなどの方法によ
）第１図（ｄ）に示すように保護膜５を形成する。以上
で凸形サーマルヘッドが完成する。After that, the resist is removed. After that, the portion of the resistor layer 3 exposed by the V cyst removal that will become the heating element is selected with a jig, and protected (by sputtering or other method) as shown in FIG. 1(d). A film 5 is formed. With the above steps, the convex thermal head is completed.
このよりな一実施例における各材料の具体例を以下に記
す。Specific examples of each material in this more specific example will be described below.
可撓性フィルム：東し製カプトンフィルム（商品名）厚
さ７５μｍ
接着剤：エポキシ系接着剤
抵抗層：無電解Ｎｉ −Ｐ ＩｊＬＪｌ ０．３ ａｍ
配線層：電気めっき皮膜（Ｎｉ ： ２ｐｍ 、 Ｃｕ
： ５μｍ。Flexible film: Toshi Kapton film (trade name) thickness 75 μm Adhesive: Epoxy adhesive Resistance layer: Electroless Ni-P IjLJl 0.3 am
Wiring layer: Electroplated film (Ni: 2pm, Cu
: 5μm.
Ａｕ ： ０ 、３μｍ）
保護膜： ＳｉＣＬＯｔｔｍ
これより明らかなように、上記一実施例では、可撓性フ
ィルムｌとしてカプトンフィルムを用い、これにＰｄを
付与するが、予めＰｄを付与した可撓性フィルム（例え
ば東しアデイテイプ用カプトンフィルム）を用いること
もできる。また、可撓性フィルムｌの材質もポリイミド
の他、ポリプロピレン、ポリエチレン、ポリエステルな
どを使用可能でＴｏ、ｉｊ）、Ｐｄ付与方法も、スパッ
タや蒸着による方法の他、シエーリング社製アクチベー
タネオガンドプロセスなどの湿式のＰｄ付与によること
も可能である。また、抵抗層３の材料に関してもＮｉ
−Ｐの他、Ｎ１−Ｂ、Ｎ１−Ｗ−Ｐなどの他の無電解め
っき被膜に置き換えることができる。さらに、接着剤、
配線層４．保護膜５に関しても材料は限定されず、保持
体２も金属の他、ガラス、セラミクス樹脂製などを用い
ることができる。また、配線層４および保ｉｆＩ膜５の
形成方法も他の方法とすることができる。Au: 0, 3 μm) Protective film: SiCLOttm As is clear from this, in the above example, a Kapton film is used as the flexible film l, and Pd is added to it. A film (for example, Kapton film for adhesive tape) can also be used. In addition, the material of the flexible film 1 can be polyimide, polypropylene, polyethylene, polyester, etc.To, ij), and the Pd application method can be sputtering, vapor deposition, Schering's activator neogand process, etc. It is also possible to apply Pd using a wet method. Furthermore, regarding the material of the resistance layer 3, Ni
-P can be replaced with other electroless plating films such as N1-B and N1-W-P. In addition, adhesive,
Wiring layer 4. The material for the protective film 5 is not limited either, and the holder 2 can also be made of glass, ceramic resin, etc. in addition to metal. Further, the wiring layer 4 and the retention ifI film 5 may be formed using other methods.
（発明の効果）
以上のように、この発明の方法では、可撓性フィルムを
保持体に貼り付けた後（変形させた後）、抵抗層、配線
層および保＊＊の形成を行ったので、発熱体および保護
膜に変形によるマイクロクラックが生じることはない。(Effects of the Invention) As described above, in the method of the present invention, after the flexible film is attached to the holder (deformed), the resistance layer, the wiring layer, and the insulation layer are formed. , microcracks due to deformation do not occur in the heating element or protective film.
したがって、感熱紙との密着性に優れた凸形サーマルヘ
ッドを信頼性高く作ることができる。Therefore, a convex thermal head with excellent adhesion to thermal paper can be manufactured with high reliability.
（図面）
第１図はこの発明の凸形サーマルヘッドの製造方法の一
実施例を工程順に示す断面図である。
ｌ・・・可撓性フィルム、２・・・保持体、３・・・抵
抗層、４・・・配線層、５・・・保護膜。(Drawings) FIG. 1 is a sectional view showing an embodiment of the method for manufacturing a convex thermal head according to the present invention in the order of steps. 1... Flexible film, 2... Holder, 3... Resistance layer, 4... Wiring layer, 5... Protective film.
Claims (1)
よりパターン部にのみ残す工程と、 （ｂ）その後、可撓性フィルムを凸形形状の保持体に貼
り付ける工程と、 （ｃ）その貼り付けられた可撓性フィルム上のパターン
部のＰｄ上に無電解めつきにより抵抗層を形成する工程
と、 （ｄ）その抵抗層上に発熱体となる部分を除いて配線層
を形成し、さらに発熱体となる部分には保護膜を形成す
る工程とを具備してなる凸形サーマルヘツドの製造方法
。[Claims] (a) A step in which Pd on the flexible film is left only in the pattern portion by photolithography; (b) Thereafter, a step in which the flexible film is attached to a convex-shaped holder; , (c) forming a resistive layer on the Pd of the pattern portion on the attached flexible film by electroless plating, and (d) excluding the part that will become the heating element on the resistive layer. A method for manufacturing a convex thermal head comprising the steps of forming a wiring layer and further forming a protective film on a portion that will become a heating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60112030A JPS61270167A (en) | 1985-05-27 | 1985-05-27 | Manufacture of protuberant form thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60112030A JPS61270167A (en) | 1985-05-27 | 1985-05-27 | Manufacture of protuberant form thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61270167A true JPS61270167A (en) | 1986-11-29 |
| JPH0479309B2 JPH0479309B2 (en) | 1992-12-15 |
Family
ID=14576243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60112030A Granted JPS61270167A (en) | 1985-05-27 | 1985-05-27 | Manufacture of protuberant form thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61270167A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268769A (en) * | 1985-09-20 | 1987-03-28 | Fuji Xerox Co Ltd | Curved surface type thermal head and manufacture thereof |
| JPH01119345U (en) * | 1988-02-08 | 1989-08-11 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5772874A (en) * | 1980-10-24 | 1982-05-07 | Mitsubishi Electric Corp | Thermal head and preparation thereof |
| JPS57185173A (en) * | 1981-05-11 | 1982-11-15 | Oki Electric Ind Co Ltd | Thermal head |
-
1985
- 1985-05-27 JP JP60112030A patent/JPS61270167A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5772874A (en) * | 1980-10-24 | 1982-05-07 | Mitsubishi Electric Corp | Thermal head and preparation thereof |
| JPS57185173A (en) * | 1981-05-11 | 1982-11-15 | Oki Electric Ind Co Ltd | Thermal head |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268769A (en) * | 1985-09-20 | 1987-03-28 | Fuji Xerox Co Ltd | Curved surface type thermal head and manufacture thereof |
| JPH01119345U (en) * | 1988-02-08 | 1989-08-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0479309B2 (en) | 1992-12-15 |
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