JPS5718370A - Cutting method for semiconductor pressure sensor - Google Patents

Cutting method for semiconductor pressure sensor

Info

Publication number
JPS5718370A
JPS5718370A JP9271680A JP9271680A JPS5718370A JP S5718370 A JPS5718370 A JP S5718370A JP 9271680 A JP9271680 A JP 9271680A JP 9271680 A JP9271680 A JP 9271680A JP S5718370 A JPS5718370 A JP S5718370A
Authority
JP
Japan
Prior art keywords
insulator
wafer
semiconductor
cut
pressure sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9271680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6336154B2 (enExample
Inventor
Kazuji Yamada
Kiyomitsu Suzuki
Shigeyuki Kobori
Motohisa Nishihara
Satoshi Shimada
Noriyoshi Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9271680A priority Critical patent/JPS5718370A/ja
Publication of JPS5718370A publication Critical patent/JPS5718370A/ja
Publication of JPS6336154B2 publication Critical patent/JPS6336154B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure

Landscapes

  • Dicing (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP9271680A 1980-07-09 1980-07-09 Cutting method for semiconductor pressure sensor Granted JPS5718370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9271680A JPS5718370A (en) 1980-07-09 1980-07-09 Cutting method for semiconductor pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9271680A JPS5718370A (en) 1980-07-09 1980-07-09 Cutting method for semiconductor pressure sensor

Publications (2)

Publication Number Publication Date
JPS5718370A true JPS5718370A (en) 1982-01-30
JPS6336154B2 JPS6336154B2 (enExample) 1988-07-19

Family

ID=14062173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9271680A Granted JPS5718370A (en) 1980-07-09 1980-07-09 Cutting method for semiconductor pressure sensor

Country Status (1)

Country Link
JP (1) JPS5718370A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207386A (ja) * 1984-03-31 1985-10-18 Toyota Central Res & Dev Lab Inc 半導体圧力センサウエハの切断方法
JPH02306669A (ja) * 1989-05-20 1990-12-20 Sanyo Electric Co Ltd 半導体圧力センサ素子の分離方法
JP2010232378A (ja) * 2009-03-26 2010-10-14 Oki Semiconductor Co Ltd 半導体装置の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007165789A (ja) * 2005-12-16 2007-06-28 Olympus Corp 半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5062015A (enExample) * 1973-10-01 1975-05-27
JPS5384280A (en) * 1976-12-29 1978-07-25 Daiichi Seitoshiyo Kk Cutting method and cutting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5062015A (enExample) * 1973-10-01 1975-05-27
JPS5384280A (en) * 1976-12-29 1978-07-25 Daiichi Seitoshiyo Kk Cutting method and cutting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207386A (ja) * 1984-03-31 1985-10-18 Toyota Central Res & Dev Lab Inc 半導体圧力センサウエハの切断方法
JPH02306669A (ja) * 1989-05-20 1990-12-20 Sanyo Electric Co Ltd 半導体圧力センサ素子の分離方法
JP2010232378A (ja) * 2009-03-26 2010-10-14 Oki Semiconductor Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6336154B2 (enExample) 1988-07-19

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