JPS5667934A - Dicing system of semiconductor wafer - Google Patents

Dicing system of semiconductor wafer

Info

Publication number
JPS5667934A
JPS5667934A JP14417579A JP14417579A JPS5667934A JP S5667934 A JPS5667934 A JP S5667934A JP 14417579 A JP14417579 A JP 14417579A JP 14417579 A JP14417579 A JP 14417579A JP S5667934 A JPS5667934 A JP S5667934A
Authority
JP
Japan
Prior art keywords
cutter
blade
semiconductor wafer
fitted
blades
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14417579A
Other languages
Japanese (ja)
Inventor
Akio Nawamaki
Tsutomu Matsuura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14417579A priority Critical patent/JPS5667934A/en
Publication of JPS5667934A publication Critical patent/JPS5667934A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To reduce a scribe time and to improve a yield during scribing a semiconductor wafer by a dicer by a method wherein two cutter blades are fitted at the front and the rear and the front blade is rotated clockwise and the rear blade is rotated couterclockwise. CONSTITUTION:When blades of a cutter proceed from the left side to the right side, a semiconductor wafer 11 is scribed with a blade 12 of a cutter which is fitted at the front and rotates clockwise. When blades of a cutter proceed from the right side to the left side, the semiconductor wafer 11 is scribed with a blade of a cutter which is fitted at the rear and rotates counter clockwise. if proceeded in this way, the blade 12 of a cutter proceeds with a down cut, and the semiconductor wafer is cut down with the blade of a dicer, as a result, pieces of a wafer are nearly picked up off the wafer. On this account, a yield and reliability are improved, thus, reducing time.
JP14417579A 1979-11-07 1979-11-07 Dicing system of semiconductor wafer Pending JPS5667934A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14417579A JPS5667934A (en) 1979-11-07 1979-11-07 Dicing system of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14417579A JPS5667934A (en) 1979-11-07 1979-11-07 Dicing system of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5667934A true JPS5667934A (en) 1981-06-08

Family

ID=15355944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14417579A Pending JPS5667934A (en) 1979-11-07 1979-11-07 Dicing system of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5667934A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02178005A (en) * 1988-12-29 1990-07-11 Nec Corp Slicing and separating device of wafer
US6649448B2 (en) * 2000-10-05 2003-11-18 Hitachi, Ltd. Method of manufacturing a semiconductor device having flexible wiring substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02178005A (en) * 1988-12-29 1990-07-11 Nec Corp Slicing and separating device of wafer
US6649448B2 (en) * 2000-10-05 2003-11-18 Hitachi, Ltd. Method of manufacturing a semiconductor device having flexible wiring substrate
US6902955B2 (en) 2000-10-05 2005-06-07 Renesas Technology Corp. Method of manufacturing a semiconductor device having a flexible wiring substrate

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