JPS57183059A - Package for electronic parts - Google Patents

Package for electronic parts

Info

Publication number
JPS57183059A
JPS57183059A JP6955881A JP6955881A JPS57183059A JP S57183059 A JPS57183059 A JP S57183059A JP 6955881 A JP6955881 A JP 6955881A JP 6955881 A JP6955881 A JP 6955881A JP S57183059 A JPS57183059 A JP S57183059A
Authority
JP
Japan
Prior art keywords
heat conductivity
high heat
package
substrate
movable piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6955881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236639B2 (enrdf_load_stackoverflow
Inventor
Takashi Kondo
Hiroshi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6955881A priority Critical patent/JPS57183059A/ja
Publication of JPS57183059A publication Critical patent/JPS57183059A/ja
Publication of JPS6236639B2 publication Critical patent/JPS6236639B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP6955881A 1981-05-06 1981-05-06 Package for electronic parts Granted JPS57183059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6955881A JPS57183059A (en) 1981-05-06 1981-05-06 Package for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6955881A JPS57183059A (en) 1981-05-06 1981-05-06 Package for electronic parts

Publications (2)

Publication Number Publication Date
JPS57183059A true JPS57183059A (en) 1982-11-11
JPS6236639B2 JPS6236639B2 (enrdf_load_stackoverflow) 1987-08-07

Family

ID=13406192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6955881A Granted JPS57183059A (en) 1981-05-06 1981-05-06 Package for electronic parts

Country Status (1)

Country Link
JP (1) JPS57183059A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196854U (ja) * 1982-06-24 1983-12-27 パイオニア株式会社 Ｉｃ放熱器
FR2569306A1 (fr) * 1984-08-17 1986-02-21 Nec Corp Dispositif de refroidissement pour circuits integres
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US20100133685A1 (en) * 2006-11-21 2010-06-03 The Boeing Company Direct semiconductor contact ebullient cooling package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566460A (en) * 1979-06-29 1981-01-23 Ibm Multi chip module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566460A (en) * 1979-06-29 1981-01-23 Ibm Multi chip module

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58196854U (ja) * 1982-06-24 1983-12-27 パイオニア株式会社 Ｉｃ放熱器
FR2569306A1 (fr) * 1984-08-17 1986-02-21 Nec Corp Dispositif de refroidissement pour circuits integres
USRE34696E (en) * 1985-11-29 1994-08-16 Mitsubishi Denki Kabushiki Semiconductor device housing with electrodes in press contact with the opposite sides of chip
US20100133685A1 (en) * 2006-11-21 2010-06-03 The Boeing Company Direct semiconductor contact ebullient cooling package
US8592971B2 (en) * 2006-11-21 2013-11-26 The Boeing Company Direct semiconductor contact ebullient cooling package
US20140048236A1 (en) * 2006-11-21 2014-02-20 The Boeing Company Direct semiconductor contact ebullient cooling package
US8937383B2 (en) 2006-11-21 2015-01-20 The Boeing Company Direct semiconductor contact ebullient cooling package

Also Published As

Publication number Publication date
JPS6236639B2 (enrdf_load_stackoverflow) 1987-08-07

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