JPS6435175A - Semiconductor processing device - Google Patents

Semiconductor processing device

Info

Publication number
JPS6435175A
JPS6435175A JP19321887A JP19321887A JPS6435175A JP S6435175 A JPS6435175 A JP S6435175A JP 19321887 A JP19321887 A JP 19321887A JP 19321887 A JP19321887 A JP 19321887A JP S6435175 A JPS6435175 A JP S6435175A
Authority
JP
Japan
Prior art keywords
ring
vacuum side
gas
processing device
semiconductor processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19321887A
Other languages
Japanese (ja)
Inventor
Kenji Araki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP19321887A priority Critical patent/JPS6435175A/en
Publication of JPS6435175A publication Critical patent/JPS6435175A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent generation of dust due to corrosion of an O-ring by providing a protector for preventing the O-ring from making contact with gas. on the vacuum side of the O-ring. CONSTITUTION:An O-ring 13 and an elastomer material which has resiliency, high rigidity and high corrosion resistance against gas to be handled, and which is positioned on the vacuum side 14 of the O-ring 13, are fitted in a groove 12 formed in one outer surface part of a bottom plate 11, and are arrange to be squeezed simultaneously by a seal part of a vacuum container 16. Further, a part of an elastomer material 15 is arranged to be exposed to the vacuum side. Accordingly it is possible to prevent the O-ring 13 from making contact with the gas which is treated on the vacuum side and which corrodes the O-ring 13.
JP19321887A 1987-07-31 1987-07-31 Semiconductor processing device Pending JPS6435175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19321887A JPS6435175A (en) 1987-07-31 1987-07-31 Semiconductor processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19321887A JPS6435175A (en) 1987-07-31 1987-07-31 Semiconductor processing device

Publications (1)

Publication Number Publication Date
JPS6435175A true JPS6435175A (en) 1989-02-06

Family

ID=16304275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19321887A Pending JPS6435175A (en) 1987-07-31 1987-07-31 Semiconductor processing device

Country Status (1)

Country Link
JP (1) JPS6435175A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001060558A (en) * 1999-07-01 2001-03-06 Applied Materials Inc Inert barrier for high-cleanliness epitaxial deposition system
SG85213A1 (en) * 1999-09-27 2001-12-19 Greene Tweed Inc Seal and protective shield
JP2009500580A (en) * 2005-07-07 2009-01-08 マットソン テクノロジー インコーポレイテッド Sealing apparatus and method with corrosion barrier
WO2018131487A1 (en) * 2017-01-16 2018-07-19 アイシン・エィ・ダブリュ株式会社 Seal structure and transmission equipped with same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59190578A (en) * 1983-04-11 1984-10-29 Eagle Ind Co Ltd Sealing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59190578A (en) * 1983-04-11 1984-10-29 Eagle Ind Co Ltd Sealing device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001060558A (en) * 1999-07-01 2001-03-06 Applied Materials Inc Inert barrier for high-cleanliness epitaxial deposition system
SG85213A1 (en) * 1999-09-27 2001-12-19 Greene Tweed Inc Seal and protective shield
JP2009500580A (en) * 2005-07-07 2009-01-08 マットソン テクノロジー インコーポレイテッド Sealing apparatus and method with corrosion barrier
WO2018131487A1 (en) * 2017-01-16 2018-07-19 アイシン・エィ・ダブリュ株式会社 Seal structure and transmission equipped with same
US11162588B2 (en) 2017-01-16 2021-11-02 Aisin Aw Co., Ltd. Seal structure and transmission including the same

Similar Documents

Publication Publication Date Title
JPS6457637A (en) Method and apparatus for handling wafer
KR890001157A (en) Wafer Surface Treatment Equipment
ES2093965T3 (en) VARIABLE VOLUME REACTOR TYPE DEVICE AND CELL MATERIAL CULTIVATION PROCEDURE.
EP0037876A3 (en) Electrochemical eroding process for semiconductors and semiconductor manufactured thereby
DE3272774D1 (en) Pressure relief device
GB936446A (en) Resilient seal for floating roof tank
JPS6435175A (en) Semiconductor processing device
JPS5731165A (en) Semiconductor device
JPS5617025A (en) Semiconductor device
JPS57183059A (en) Package for electronic parts
DE59710656D1 (en) Device for pressure equalization in vessels under negative pressure
JPS56120137A (en) Semiconductor pellet pickup device
JPS56169581A (en) Collector for falling mold
JPS56148842A (en) Dividing method for semiconductor wafer
JPS56126930A (en) Washing tank
JPS5642358A (en) Manufacture of semiconductor device
JPS5362548A (en) Canned goods screening device
JPS5748761A (en) Transfer device
GB2021315A (en) Container for a semiconductor device
JPS52156551A (en) Semiconductor wafer breaking method
JPS52106678A (en) Resin sealed type semiconductor device
JPS5662373A (en) Semiconductor directional pressure transformer
JPS57195739A (en) Sealing device for continuous vacuum treatment apparatus
JPS5271179A (en) Semiconductor device
JPS5625455A (en) Sealing transfer device of semiconductor device