GB785461A - An electric asymmetrically conductive system - Google Patents

An electric asymmetrically conductive system

Info

Publication number
GB785461A
GB785461A GB30098/54A GB3009854A GB785461A GB 785461 A GB785461 A GB 785461A GB 30098/54 A GB30098/54 A GB 30098/54A GB 3009854 A GB3009854 A GB 3009854A GB 785461 A GB785461 A GB 785461A
Authority
GB
United Kingdom
Prior art keywords
semi
corrugated
casing
oct
insulating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30098/54A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of GB785461A publication Critical patent/GB785461A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

785,461. Semi-conductor devices. LICENTIA PATENT-VERWALTUNGS-GES. Oct. 19, 1954 [Oct. 19, 1953], No. 30098/54. Class 37. In a semi-conductor device enclosed by a hermetically sealed casing, parts of which are connected mechanically and electrically to the semiconductor body, the casing is designed to allow for relative movement between these parts by elastic deformation to reduce stresses on the body due to thermal expansion. Corrugations provided for this purpose also increase the cooling surface. As shown in Fig. 4, the container consists of two similar flexible walls, between which the device is sandwiched, and a sealing ring of insulating material. The shape is such that in any position the device is covered by cooling liquid 27 which boils near the working temperature and may be alcohol, carbon tetrachloride or a mixture of diphenyl and diphenyl oxide. In a similar construction, the walls are corrugated discs, Fig. 2 (not shown). In another construction, Fig. 3, using cooling liquid 21, a substantially cylindrical casing has a corrugated wall 19 and an end plate 18 of insulating material in which is mounted a terminal plate connected to the semi-conductor device by a corrugated cylinder 20. In a similar construction, Fig. 1 (not shown), the latter cylinder is replaced by a metal rod which projects through an insulating end plate.
GB30098/54A 1953-10-19 1954-10-19 An electric asymmetrically conductive system Expired GB785461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE785461X 1953-10-19

Publications (1)

Publication Number Publication Date
GB785461A true GB785461A (en) 1957-10-30

Family

ID=6698775

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30098/54A Expired GB785461A (en) 1953-10-19 1954-10-19 An electric asymmetrically conductive system

Country Status (2)

Country Link
FR (1) FR1108663A (en)
GB (1) GB785461A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1098618B (en) * 1958-07-25 1961-02-02 Telefunken Gmbh Housing for semiconductor arrangements of the smallest dimensions
DE1184000B (en) * 1962-05-18 1964-12-23 Siemens Ag Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this
DE1185728B (en) * 1960-05-18 1965-01-21 Siemens Ag Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element
DE1194503B (en) * 1960-04-29 1965-06-10 Silec Liaisons Elec Semiconductor diode and process for its manufacture
DE1204751B (en) * 1960-09-30 1965-11-11 Siemens Ag Semiconductor component with a disk-shaped housing and method for producing such a component
DE1210956B (en) * 1963-07-04 1966-02-17 Siemens Ag Semiconductor rectifier cooled by an insulating liquid
US3780356A (en) * 1969-02-27 1973-12-18 Laing Nikolaus Cooling device for semiconductor components
US4161747A (en) * 1978-02-24 1979-07-17 Nasa Shock isolator for operating a diode laser on a closed-cycle refrigerator
US4313492A (en) * 1979-12-20 1982-02-02 International Business Machines Corporation Micro helix thermo capsule
US4395728A (en) * 1979-08-24 1983-07-26 Li Chou H Temperature controlled apparatus
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL101591C (en) * 1956-03-22
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1098618B (en) * 1958-07-25 1961-02-02 Telefunken Gmbh Housing for semiconductor arrangements of the smallest dimensions
DE1194503B (en) * 1960-04-29 1965-06-10 Silec Liaisons Elec Semiconductor diode and process for its manufacture
DE1185728B (en) * 1960-05-18 1965-01-21 Siemens Ag Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element
DE1204751B (en) * 1960-09-30 1965-11-11 Siemens Ag Semiconductor component with a disk-shaped housing and method for producing such a component
DE1184000B (en) * 1962-05-18 1964-12-23 Siemens Ag Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this
DE1210956B (en) * 1963-07-04 1966-02-17 Siemens Ag Semiconductor rectifier cooled by an insulating liquid
US3780356A (en) * 1969-02-27 1973-12-18 Laing Nikolaus Cooling device for semiconductor components
US4161747A (en) * 1978-02-24 1979-07-17 Nasa Shock isolator for operating a diode laser on a closed-cycle refrigerator
US4395728A (en) * 1979-08-24 1983-07-26 Li Chou H Temperature controlled apparatus
US4313492A (en) * 1979-12-20 1982-02-02 International Business Machines Corporation Micro helix thermo capsule
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
US5587880A (en) * 1995-06-28 1996-12-24 Aavid Laboratories, Inc. Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation

Also Published As

Publication number Publication date
FR1108663A (en) 1956-01-16

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