GB785461A - An electric asymmetrically conductive system - Google Patents
An electric asymmetrically conductive systemInfo
- Publication number
- GB785461A GB785461A GB30098/54A GB3009854A GB785461A GB 785461 A GB785461 A GB 785461A GB 30098/54 A GB30098/54 A GB 30098/54A GB 3009854 A GB3009854 A GB 3009854A GB 785461 A GB785461 A GB 785461A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- corrugated
- casing
- oct
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
785,461. Semi-conductor devices. LICENTIA PATENT-VERWALTUNGS-GES. Oct. 19, 1954 [Oct. 19, 1953], No. 30098/54. Class 37. In a semi-conductor device enclosed by a hermetically sealed casing, parts of which are connected mechanically and electrically to the semiconductor body, the casing is designed to allow for relative movement between these parts by elastic deformation to reduce stresses on the body due to thermal expansion. Corrugations provided for this purpose also increase the cooling surface. As shown in Fig. 4, the container consists of two similar flexible walls, between which the device is sandwiched, and a sealing ring of insulating material. The shape is such that in any position the device is covered by cooling liquid 27 which boils near the working temperature and may be alcohol, carbon tetrachloride or a mixture of diphenyl and diphenyl oxide. In a similar construction, the walls are corrugated discs, Fig. 2 (not shown). In another construction, Fig. 3, using cooling liquid 21, a substantially cylindrical casing has a corrugated wall 19 and an end plate 18 of insulating material in which is mounted a terminal plate connected to the semi-conductor device by a corrugated cylinder 20. In a similar construction, Fig. 1 (not shown), the latter cylinder is replaced by a metal rod which projects through an insulating end plate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE785461X | 1953-10-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB785461A true GB785461A (en) | 1957-10-30 |
Family
ID=6698775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB30098/54A Expired GB785461A (en) | 1953-10-19 | 1954-10-19 | An electric asymmetrically conductive system |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1108663A (en) |
GB (1) | GB785461A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1098618B (en) * | 1958-07-25 | 1961-02-02 | Telefunken Gmbh | Housing for semiconductor arrangements of the smallest dimensions |
DE1184000B (en) * | 1962-05-18 | 1964-12-23 | Siemens Ag | Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this |
DE1185728B (en) * | 1960-05-18 | 1965-01-21 | Siemens Ag | Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element |
DE1194503B (en) * | 1960-04-29 | 1965-06-10 | Silec Liaisons Elec | Semiconductor diode and process for its manufacture |
DE1204751B (en) * | 1960-09-30 | 1965-11-11 | Siemens Ag | Semiconductor component with a disk-shaped housing and method for producing such a component |
DE1210956B (en) * | 1963-07-04 | 1966-02-17 | Siemens Ag | Semiconductor rectifier cooled by an insulating liquid |
US3780356A (en) * | 1969-02-27 | 1973-12-18 | Laing Nikolaus | Cooling device for semiconductor components |
US4161747A (en) * | 1978-02-24 | 1979-07-17 | Nasa | Shock isolator for operating a diode laser on a closed-cycle refrigerator |
US4313492A (en) * | 1979-12-20 | 1982-02-02 | International Business Machines Corporation | Micro helix thermo capsule |
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
US5587880A (en) * | 1995-06-28 | 1996-12-24 | Aavid Laboratories, Inc. | Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL101591C (en) * | 1956-03-22 | |||
US3460002A (en) * | 1965-09-29 | 1969-08-05 | Microwave Ass | Semiconductor diode construction and mounting |
-
1954
- 1954-09-29 FR FR1108663D patent/FR1108663A/en not_active Expired
- 1954-10-19 GB GB30098/54A patent/GB785461A/en not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1098618B (en) * | 1958-07-25 | 1961-02-02 | Telefunken Gmbh | Housing for semiconductor arrangements of the smallest dimensions |
DE1194503B (en) * | 1960-04-29 | 1965-06-10 | Silec Liaisons Elec | Semiconductor diode and process for its manufacture |
DE1185728B (en) * | 1960-05-18 | 1965-01-21 | Siemens Ag | Semiconductor arrangement, in particular surface rectifier or transistor with a single-crystal semiconductor element |
DE1204751B (en) * | 1960-09-30 | 1965-11-11 | Siemens Ag | Semiconductor component with a disk-shaped housing and method for producing such a component |
DE1184000B (en) * | 1962-05-18 | 1964-12-23 | Siemens Ag | Installation of a disc-shaped electrical semiconductor component in a recess of another structural part, in particular a housing of an electrical machine or an additional part carried by this |
DE1210956B (en) * | 1963-07-04 | 1966-02-17 | Siemens Ag | Semiconductor rectifier cooled by an insulating liquid |
US3780356A (en) * | 1969-02-27 | 1973-12-18 | Laing Nikolaus | Cooling device for semiconductor components |
US4161747A (en) * | 1978-02-24 | 1979-07-17 | Nasa | Shock isolator for operating a diode laser on a closed-cycle refrigerator |
US4395728A (en) * | 1979-08-24 | 1983-07-26 | Li Chou H | Temperature controlled apparatus |
US4313492A (en) * | 1979-12-20 | 1982-02-02 | International Business Machines Corporation | Micro helix thermo capsule |
US5458189A (en) * | 1993-09-10 | 1995-10-17 | Aavid Laboratories | Two-phase component cooler |
US5587880A (en) * | 1995-06-28 | 1996-12-24 | Aavid Laboratories, Inc. | Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation |
Also Published As
Publication number | Publication date |
---|---|
FR1108663A (en) | 1956-01-16 |
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