GB809071A - Improvements in or relating to transistors - Google Patents

Improvements in or relating to transistors

Info

Publication number
GB809071A
GB809071A GB23334/55A GB2333455A GB809071A GB 809071 A GB809071 A GB 809071A GB 23334/55 A GB23334/55 A GB 23334/55A GB 2333455 A GB2333455 A GB 2333455A GB 809071 A GB809071 A GB 809071A
Authority
GB
United Kingdom
Prior art keywords
cap
sealed
copper
base
germanium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB23334/55A
Inventor
Ralph David Knott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DENDAT1048358D priority Critical patent/DE1048358B/de
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB23334/55A priority patent/GB809071A/en
Priority to US603354A priority patent/US2810873A/en
Priority to FR1155743D priority patent/FR1155743A/en
Priority to GB28956/57A priority patent/GB838987A/en
Publication of GB809071A publication Critical patent/GB809071A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S220/00—Receptacles
    • Y10S220/29—Welded seam

Abstract

809,071. Transistor construction. GENERAL ELECTRIC CO. Ltd. Aug. 13, 1956 [Aug. 12, 1955], No. 23334/55. Class 37. A transistor designed for good heat dissipation consists of a piece of germanium 1 mounted on a recess in a U- shaped copper member 6. The member 6 forms the base, and collector and emitter electrodes of indium are disposed on each side of the germanium and have terminals attached at 4 and 5. Leads from the three electrodes are sealed in a glass base 10 which has sealed to it a copper cover 9. A copper cap 15 is placed over the assembly which is in tight contact with 6 due to the shape and resilient nature of this base plate. The cap 15 is also sealed by cold pressure welding on to the copper cover 9. In a modification the end of the base electrode next to the closed end of the cap is fitted with tongues adapted to bear resiliently against the end of the cap.
GB23334/55A 1955-08-12 1955-08-12 Improvements in or relating to transistors Expired GB809071A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DENDAT1048358D DE1048358B (en) 1955-08-12
GB23334/55A GB809071A (en) 1955-08-12 1955-08-12 Improvements in or relating to transistors
US603354A US2810873A (en) 1955-08-12 1956-08-10 Transistors
FR1155743D FR1155743A (en) 1955-08-12 1956-08-11 Improvements to transistors
GB28956/57A GB838987A (en) 1955-08-12 1957-09-13 Improvements in or relating to transistors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB23334/55A GB809071A (en) 1955-08-12 1955-08-12 Improvements in or relating to transistors
GB28956/57A GB838987A (en) 1955-08-12 1957-09-13 Improvements in or relating to transistors

Publications (1)

Publication Number Publication Date
GB809071A true GB809071A (en) 1959-02-18

Family

ID=62527903

Family Applications (2)

Application Number Title Priority Date Filing Date
GB23334/55A Expired GB809071A (en) 1955-08-12 1955-08-12 Improvements in or relating to transistors
GB28956/57A Expired GB838987A (en) 1955-08-12 1957-09-13 Improvements in or relating to transistors

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB28956/57A Expired GB838987A (en) 1955-08-12 1957-09-13 Improvements in or relating to transistors

Country Status (4)

Country Link
US (1) US2810873A (en)
DE (1) DE1048358B (en)
FR (1) FR1155743A (en)
GB (2) GB809071A (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3182845A (en) * 1965-05-11 Housing for an electronic device
NL212855A (en) * 1955-03-10
GB818464A (en) * 1956-03-12 1959-08-19 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
NL238557A (en) * 1958-04-24
US3155936A (en) * 1958-04-24 1964-11-03 Motorola Inc Transistor device with self-jigging construction
US2977515A (en) * 1958-05-07 1961-03-28 Philco Corp Semiconductor fabrication
NL244922A (en) * 1958-11-03
NL251229A (en) * 1959-05-05
DE1083438B (en) * 1959-05-23 1960-06-15 Elektronik M B H Transistor arrangement enclosed by a metal housing
US3039175A (en) * 1959-11-09 1962-06-19 Solid State Products Inc Sealing of electrical semiconductor devices
US3020454A (en) * 1959-11-09 1962-02-06 Solid State Products Inc Sealing of electrical semiconductor devices
NL258753A (en) * 1959-12-07
US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3196326A (en) * 1961-07-14 1965-07-20 Gen Electric Co Ltd Transistor with mounting providing efficient heat dissipation through an envelope and method of making the same
US3241217A (en) * 1962-11-09 1966-03-22 Philco Corp Desiccation of electronic enclosures using boron nitride hot sealing method
US3735208A (en) * 1971-08-26 1973-05-22 Rca Corp Thermal fatigue lead-soldered semiconductor device
US20060015100A1 (en) * 2004-06-23 2006-01-19 Panjabi Manohar M Spinal stabilization devices coupled by torsional member

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2673311A (en) * 1948-07-24 1954-03-23 Sylvania Electric Prod Crystal amplifier
US2615965A (en) * 1948-07-24 1952-10-28 Sylvania Electric Prod Crystal amplifier device
US2661448A (en) * 1948-12-20 1953-12-01 North American Aviation Inc Transfer resistor and method of making

Also Published As

Publication number Publication date
DE1048358B (en) 1959-01-08
GB838987A (en) 1960-06-22
FR1155743A (en) 1958-05-07
US2810873A (en) 1957-10-22

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