JPS57177588A - Laser diode - Google Patents

Laser diode

Info

Publication number
JPS57177588A
JPS57177588A JP6237481A JP6237481A JPS57177588A JP S57177588 A JPS57177588 A JP S57177588A JP 6237481 A JP6237481 A JP 6237481A JP 6237481 A JP6237481 A JP 6237481A JP S57177588 A JPS57177588 A JP S57177588A
Authority
JP
Japan
Prior art keywords
chip
stem
flange
laser diode
photosensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6237481A
Other languages
Japanese (ja)
Inventor
Takeo Takahashi
Masato Tozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Hitachi Iruma Electronic Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Hitachi Iruma Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd, Hitachi Iruma Electronic Co Ltd filed Critical Hitachi Ltd
Priority to JP6237481A priority Critical patent/JPS57177588A/en
Publication of JPS57177588A publication Critical patent/JPS57177588A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the incidence of the reflected light from a sensor into a transparent window for the stabilization of radiated laser light, by providing an interception plate on the side surface of a chip surrounded thereby when containing a stem and photosensor fixed with a laser diode chip in a package material having a transparent window. CONSTITUTION:The stem 3 is erected on a flange 2 constituted of metal with good thermal conductivity with a lead 11 projecte outside the device fixing the laser diode chip 5 on the upper side surface thereof via a submount plate 4. Next, the lead 11 passed through the flange 2 is provided on the side of the chip 5 in the same way. The following process is taken when arranging the photosensor 7 positioned therebetween and the chip 5 on the flange 2: an opaque interception plate 13 along the side surface of the chip 5 is streatched across over the upper end of the stem 4 including the chip 5 to be fixed on the inside wall of a metallic cap 8 by an adhesive 14.
JP6237481A 1981-04-27 1981-04-27 Laser diode Pending JPS57177588A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6237481A JPS57177588A (en) 1981-04-27 1981-04-27 Laser diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6237481A JPS57177588A (en) 1981-04-27 1981-04-27 Laser diode

Publications (1)

Publication Number Publication Date
JPS57177588A true JPS57177588A (en) 1982-11-01

Family

ID=13198272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6237481A Pending JPS57177588A (en) 1981-04-27 1981-04-27 Laser diode

Country Status (1)

Country Link
JP (1) JPS57177588A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS64354U (en) * 1987-06-18 1989-01-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS64354U (en) * 1987-06-18 1989-01-05

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