JPS5717497A - Manufacture of silicon single crystal - Google Patents
Manufacture of silicon single crystalInfo
- Publication number
- JPS5717497A JPS5717497A JP8887880A JP8887880A JPS5717497A JP S5717497 A JPS5717497 A JP S5717497A JP 8887880 A JP8887880 A JP 8887880A JP 8887880 A JP8887880 A JP 8887880A JP S5717497 A JPS5717497 A JP S5717497A
- Authority
- JP
- Japan
- Prior art keywords
- nitrogen
- single crystal
- contg
- silicon single
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
PURPOSE: To raise the discharge starting voltage in high frequency heating and to grow a single crystal having a larger diameter by growing a silicon singla crystal in an atmospheric gas formed by adding gaseous nitrogen or a nitrogen-contg. compound to Ar or a mixed gas of Ar and hydrogen to introduce nitrogen atoms into the crystal.
CONSTITUTION: An atmospheric gas is formed by adding gaseous nitrogen or a nitrogen-contg. compound to Ar or a mixed gas of Ar and hydrogen. The gaseous nitrogen concn. is adjusted to 0.05W3vol%. As the nitrogen-contg. compound ammonia, hydrazine or nitrogen trifluoride is used. By growing a silicon single crystal in the atmospheric gas, a silicon single crystal contg. nitrogen atoms is obtd.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8887880A JPS5717497A (en) | 1980-06-30 | 1980-06-30 | Manufacture of silicon single crystal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8887880A JPS5717497A (en) | 1980-06-30 | 1980-06-30 | Manufacture of silicon single crystal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5717497A true JPS5717497A (en) | 1982-01-29 |
JPH0341437B2 JPH0341437B2 (en) | 1991-06-24 |
Family
ID=13955252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8887880A Granted JPS5717497A (en) | 1980-06-30 | 1980-06-30 | Manufacture of silicon single crystal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5717497A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60251190A (en) * | 1984-05-25 | 1985-12-11 | Shin Etsu Handotai Co Ltd | Preparation of silicon single crystal |
JPS6117495A (en) * | 1984-05-03 | 1986-01-25 | テキサス インスツルメンツ インコ−ポレイテツド | Formation of silicon single crystal |
JPH033244A (en) * | 1989-05-30 | 1991-01-09 | Shin Etsu Handotai Co Ltd | Heat treatment method for semiconductor silicon substrate |
JPH05294780A (en) * | 1992-04-21 | 1993-11-09 | Shin Etsu Handotai Co Ltd | Production of silicon single crystal |
JPH0891993A (en) * | 1995-04-27 | 1996-04-09 | Shin Etsu Handotai Co Ltd | Production of silicon single crystal substrate and method for quality control |
US6350703B1 (en) | 1998-07-08 | 2002-02-26 | Canon Kabushiki Kaisha | Semiconductor substrate and production method thereof |
US6548886B1 (en) | 1998-05-01 | 2003-04-15 | Wacker Nsce Corporation | Silicon semiconductor wafer and method for producing the same |
US6843848B2 (en) | 2000-03-24 | 2005-01-18 | Siltronic Ag | Semiconductor wafer made from silicon and method for producing the semiconductor wafer |
CN103436951A (en) * | 2013-08-27 | 2013-12-11 | 天津市环欧半导体材料技术有限公司 | Drawing method of float-zone silicon single crystals |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4831052A (en) * | 1971-08-26 | 1973-04-24 |
-
1980
- 1980-06-30 JP JP8887880A patent/JPS5717497A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4831052A (en) * | 1971-08-26 | 1973-04-24 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6117495A (en) * | 1984-05-03 | 1986-01-25 | テキサス インスツルメンツ インコ−ポレイテツド | Formation of silicon single crystal |
JPS60251190A (en) * | 1984-05-25 | 1985-12-11 | Shin Etsu Handotai Co Ltd | Preparation of silicon single crystal |
JPH033244A (en) * | 1989-05-30 | 1991-01-09 | Shin Etsu Handotai Co Ltd | Heat treatment method for semiconductor silicon substrate |
JPH05294780A (en) * | 1992-04-21 | 1993-11-09 | Shin Etsu Handotai Co Ltd | Production of silicon single crystal |
JPH0891993A (en) * | 1995-04-27 | 1996-04-09 | Shin Etsu Handotai Co Ltd | Production of silicon single crystal substrate and method for quality control |
US6548886B1 (en) | 1998-05-01 | 2003-04-15 | Wacker Nsce Corporation | Silicon semiconductor wafer and method for producing the same |
US6350703B1 (en) | 1998-07-08 | 2002-02-26 | Canon Kabushiki Kaisha | Semiconductor substrate and production method thereof |
US6843848B2 (en) | 2000-03-24 | 2005-01-18 | Siltronic Ag | Semiconductor wafer made from silicon and method for producing the semiconductor wafer |
CN103436951A (en) * | 2013-08-27 | 2013-12-11 | 天津市环欧半导体材料技术有限公司 | Drawing method of float-zone silicon single crystals |
Also Published As
Publication number | Publication date |
---|---|
JPH0341437B2 (en) | 1991-06-24 |
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