JPS57162460A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57162460A JPS57162460A JP4747181A JP4747181A JPS57162460A JP S57162460 A JPS57162460 A JP S57162460A JP 4747181 A JP4747181 A JP 4747181A JP 4747181 A JP4747181 A JP 4747181A JP S57162460 A JPS57162460 A JP S57162460A
- Authority
- JP
- Japan
- Prior art keywords
- region
- film
- layer
- type
- emitter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010408 film Substances 0.000 abstract 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000002955 isolation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
Abstract
PURPOSE:To prevent surely short-circuit between an emitter and a base when the emitter region of a bipolar semiconductor device is to be formed by a method wherein after impurity ions are implanted from windows for emitter electrode through a thin insulating film, the thin film is removed by etching having the orientating property. CONSTITUTION:An n<+> type buried layer 8 is formed by diffusion in a p type Si substrate 7, an n type layer 1 to be made as the collector region is made to grow epitaxially on the whole surface containing the buried layer thereof, and the layer 1 is made to form an island type containing the layer 8 by the isolation region. Then a p<+> type base region 2 is formed by diffusion in the layer 1 formed in the island type, and an SiO2 film 6 is adhered on the whole surface containing the base region. After then, respective windows 10-12 for electrodes of emitter, collector contact, and base are formed in the film 6, and heat treatment is performed to make thin SiO2 films 5 to be generated in the windows thereof. Then the upper part of the window 12 is covered with a resist film 13, ions are implanted in the windows 10, 11 through the film 5 to provide the n<+> type emitter region 3 and the collector contact region 4 respectively in the region 2 and in the layer 1, and the film 5 made to be unnecessitated is removed in the etching device provided with the orientating property.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4747181A JPS57162460A (en) | 1981-03-31 | 1981-03-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4747181A JPS57162460A (en) | 1981-03-31 | 1981-03-31 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57162460A true JPS57162460A (en) | 1982-10-06 |
JPH0420256B2 JPH0420256B2 (en) | 1992-04-02 |
Family
ID=12776052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4747181A Granted JPS57162460A (en) | 1981-03-31 | 1981-03-31 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57162460A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS609163A (en) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS60119775A (en) * | 1983-12-02 | 1985-06-27 | Hitachi Ltd | Manufacture of semiconductor device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117554A (en) * | 1976-03-30 | 1977-10-03 | Toshiba Corp | Manufacturing method of semiconductor device |
JPS54144176A (en) * | 1978-05-01 | 1979-11-10 | Ibm | Method of forming semiconductor junction |
JPS564268A (en) * | 1979-06-22 | 1981-01-17 | Ibm | Method of forming semiconductor device |
JPS56146274A (en) * | 1980-03-24 | 1981-11-13 | Ibm | Method of manufacturing bipolar transistor |
-
1981
- 1981-03-31 JP JP4747181A patent/JPS57162460A/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52117554A (en) * | 1976-03-30 | 1977-10-03 | Toshiba Corp | Manufacturing method of semiconductor device |
JPS54144176A (en) * | 1978-05-01 | 1979-11-10 | Ibm | Method of forming semiconductor junction |
JPS564268A (en) * | 1979-06-22 | 1981-01-17 | Ibm | Method of forming semiconductor device |
JPS56146274A (en) * | 1980-03-24 | 1981-11-13 | Ibm | Method of manufacturing bipolar transistor |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS609163A (en) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS60119775A (en) * | 1983-12-02 | 1985-06-27 | Hitachi Ltd | Manufacture of semiconductor device |
JPH0580818B2 (en) * | 1983-12-02 | 1993-11-10 | Hitachi Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPH0420256B2 (en) | 1992-04-02 |
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