JPS57157533A - Bonding method for metallic small wire of semiconductor device - Google Patents

Bonding method for metallic small wire of semiconductor device

Info

Publication number
JPS57157533A
JPS57157533A JP56042685A JP4268581A JPS57157533A JP S57157533 A JPS57157533 A JP S57157533A JP 56042685 A JP56042685 A JP 56042685A JP 4268581 A JP4268581 A JP 4268581A JP S57157533 A JPS57157533 A JP S57157533A
Authority
JP
Japan
Prior art keywords
tip
gold
sphere
bonded
copper wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56042685A
Other languages
English (en)
Inventor
Naomichi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56042685A priority Critical patent/JPS57157533A/ja
Publication of JPS57157533A publication Critical patent/JPS57157533A/ja
Pending legal-status Critical Current

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Classifications

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56042685A 1981-03-23 1981-03-23 Bonding method for metallic small wire of semiconductor device Pending JPS57157533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56042685A JPS57157533A (en) 1981-03-23 1981-03-23 Bonding method for metallic small wire of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56042685A JPS57157533A (en) 1981-03-23 1981-03-23 Bonding method for metallic small wire of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57157533A true JPS57157533A (en) 1982-09-29

Family

ID=12642882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56042685A Pending JPS57157533A (en) 1981-03-23 1981-03-23 Bonding method for metallic small wire of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57157533A (ja)

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