JPS5642114B2 - - Google Patents

Info

Publication number
JPS5642114B2
JPS5642114B2 JP10416679A JP10416679A JPS5642114B2 JP S5642114 B2 JPS5642114 B2 JP S5642114B2 JP 10416679 A JP10416679 A JP 10416679A JP 10416679 A JP10416679 A JP 10416679A JP S5642114 B2 JPS5642114 B2 JP S5642114B2
Authority
JP
Japan
Prior art keywords
wire
conductor
applying
hole
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10416679A
Other languages
English (en)
Other versions
JPS5562680A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5562680A publication Critical patent/JPS5562680A/ja
Publication of JPS5642114B2 publication Critical patent/JPS5642114B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
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    • H01L2924/181—Encapsulation
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10416679A 1978-10-31 1979-08-17 Wire bonding method Granted JPS5562680A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95615878A 1978-10-31 1978-10-31

Publications (2)

Publication Number Publication Date
JPS5562680A JPS5562680A (en) 1980-05-12
JPS5642114B2 true JPS5642114B2 (ja) 1981-10-02

Family

ID=25497833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10416679A Granted JPS5562680A (en) 1978-10-31 1979-08-17 Wire bonding method

Country Status (5)

Country Link
EP (1) EP0010610B1 (ja)
JP (1) JPS5562680A (ja)
CA (1) CA1135871A (ja)
DE (1) DE2965205D1 (ja)
IT (1) IT1165447B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3370240D1 (en) * 1982-12-06 1987-04-16 Welding Inst Bonding leads to semiconductor devices
DE3390451C2 (de) * 1983-01-24 1989-05-11 Ford Werke Ag Verfahren zum Laser-L¦ten
IT1195117B (it) * 1986-08-01 1988-10-12 Vallko Srl Tettuccio apribile di autoveicolo
US4928384A (en) * 1987-03-24 1990-05-29 Cooper Industries, Inc. Method of making a wire bonded microfuse
US5093988A (en) * 1991-01-24 1992-03-10 Kohler Co. Method for attaching a flexible connector
DE69430151T2 (de) * 1993-05-21 2002-08-22 Toyota Motor Co Ltd Laserschweissverfahren
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons
DE102018213639A1 (de) * 2018-08-14 2020-02-20 Te Connectivity Germany Gmbh Verfahren zum Anbringen wenigstens eines insbesondere stiftförmigen Kontaktelements auf einer Leiterbahn einer Leiterplatte, Stiftleiste zur Anbringung auf einer Leiterplatte, Verbindungsanordnung

Also Published As

Publication number Publication date
JPS5562680A (en) 1980-05-12
IT1165447B (it) 1987-04-22
EP0010610B1 (fr) 1983-04-13
EP0010610A1 (fr) 1980-05-14
CA1135871A (en) 1982-11-16
IT7926086A0 (it) 1979-09-28
DE2965205D1 (en) 1983-05-19

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