JPS57155376A - Evaporating apparatus - Google Patents

Evaporating apparatus

Info

Publication number
JPS57155376A
JPS57155376A JP4030781A JP4030781A JPS57155376A JP S57155376 A JPS57155376 A JP S57155376A JP 4030781 A JP4030781 A JP 4030781A JP 4030781 A JP4030781 A JP 4030781A JP S57155376 A JPS57155376 A JP S57155376A
Authority
JP
Japan
Prior art keywords
evaporation source
source chamber
evaporating
chamber
evaporating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4030781A
Other languages
Japanese (ja)
Inventor
Masahiro Fujita
Akihiko Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4030781A priority Critical patent/JPS57155376A/en
Publication of JPS57155376A publication Critical patent/JPS57155376A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To improve the operating efficiency of an evaporating apparatus without waste, by making the volume of the evaporation source chamber of an evaporating apparatus small and also providing an exclusive vaccum evacuating system. CONSTITUTION:An evaporation source chamber 2 containing a crucible 12 in which evaporating metal 11 is put and an evaporating chamber 1 containing rotating plates 13 which sustain the wafer to be evaporated are partitioned by a gate valve 3 and the vapor of the metal 11 is evaporated to the wafer, evacuating the both chambers 1, 2 to vacuum. In this evaporating apparatus besides the vacuum evacuating system provided with a rotary pump 4 an exclusive vauum evacuating system 16 is provided in the evaporation source chamber 2 and also the volume of the evaporation source chamber 2 is made small, further the space surrounding the crucible 12 is separated from the evaporation chamber 2 by another small gate valve if necessary. Because only the evaporation source chamber 2 can be disclosed to an open air, while the gate valve 3 is closed, and further it can be evacuated to vacuum, when purifying the crucible 12, exchanging the evaporation metal 11 etc., operating efficiency of the evaporating apparatus can be largely improved.
JP4030781A 1981-03-23 1981-03-23 Evaporating apparatus Pending JPS57155376A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4030781A JPS57155376A (en) 1981-03-23 1981-03-23 Evaporating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4030781A JPS57155376A (en) 1981-03-23 1981-03-23 Evaporating apparatus

Publications (1)

Publication Number Publication Date
JPS57155376A true JPS57155376A (en) 1982-09-25

Family

ID=12576953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4030781A Pending JPS57155376A (en) 1981-03-23 1981-03-23 Evaporating apparatus

Country Status (1)

Country Link
JP (1) JPS57155376A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069939U (en) * 1991-12-27 1994-02-08 リョービ株式会社 Continuous water supply device for offset printing machine
JP2005530042A (en) * 2002-06-18 2005-10-06 リベル Material evaporation chamber with differential vacuum pumping
CN107327817A (en) * 2016-01-25 2017-11-07 友仁株式会社 The vacuum and steam circulatory system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069939U (en) * 1991-12-27 1994-02-08 リョービ株式会社 Continuous water supply device for offset printing machine
JP2005530042A (en) * 2002-06-18 2005-10-06 リベル Material evaporation chamber with differential vacuum pumping
JP4918221B2 (en) * 2002-06-18 2012-04-18 リベル Material evaporation chamber with differential vacuum pumping
US8894769B2 (en) 2002-06-18 2014-11-25 Riber Material evaporation chamber with differential vacuum pumping
CN107327817A (en) * 2016-01-25 2017-11-07 友仁株式会社 The vacuum and steam circulatory system
CN107327817B (en) * 2016-01-25 2020-06-26 友仁株式会社 Vacuum steam circulation system

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