JPH0241164Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a vapor deposition apparatus, and particularly relates to an improvement of an apparatus for recovering vapor deposition material.

[Prior art]

Conventionally, there has been a device of this type as shown in FIG. In the figure, reference numeral 1 denotes a vacuum container housing a vapor deposition apparatus main body (not shown), and 3 a vacuum pump for evacuating the vacuum container 1, which is attached to the tip of an exhaust pipe 4 of the vacuum container 1. Reference numeral 2 designates a material recovery container provided within the enlarged portion 4a of the drain pipe 4 and containing liquid nitrogen.

Next, the operation will be explained.

A part of the vapor deposition material generated from the vapor deposition apparatus main body in the vacuum container 1 passes through the exhaust pipe 4 and flies toward the vacuum pump 3, but the material containing liquid nitrogen provided in the middle of the exhaust pipe 4 The material collides with the collection container 2, is cooled and adheres to the outer wall of the material collection container 2, and hardly flows into the vacuum pump 3.

In a conventional device of this type, the material recovery container 2 was fixed to the exhaust pipe 4, so the exhaust conductance of the vacuum container 1 was constant;
There was a risk that the exhaust time would become longer.

[Summary of the idea]

This idea was made in order to eliminate the drawbacks of the conventional ones as described above, and by making the material recovery container containing a cooling medium such as liquid nitrogen movable from outside the exhaust system, the exhaust conductance can be reduced. The purpose of the present invention is to provide a vapor deposition apparatus that can make the

[Example of idea]

Hereinafter, embodiments of this invention will be described with reference to the drawings.

2 and 3 show a vapor deposition apparatus according to an embodiment of the present invention. In both figures, 1 is a vacuum container housing a vapor deposition apparatus main body (not shown), 3 is a vacuum pump for evacuating the vacuum container 1, and 14 is provided between the vacuum pump 3 and the vacuum container 1. Drainage pipe, 1
4a is an enlarged portion of the exhaust pipe 14, and 12 is a material recovery container consisting of four fin-like bodies 12a for storing a cooling medium such as liquid nitrogen and recovering the vapor deposition material. It is provided so that it can be rotated freely. That is, FIG. 2 shows a state in which the exhaust conductance of the vacuum container 1 is maximized by the material recovery container 12, and FIG. 3 shows a state in which this is reduced.

Next, the operation will be explained.

First, by rotating the material recovery container 12 to the state shown in FIG. 2, the exhaust conductance of the vacuum container 1 can be maximized. In this state, the inside of the vacuum container 1 is removed from the atmosphere using the vacuum pump 3. Evacuate to high vacuum below 10 ^-4 Torr. In this case, this evacuation can be carried out in a short time.

Next, when the inside of the vacuum container 1 reaches a predetermined degree of vacuum and the main body of the evaporation apparatus begins to generate a deposition substance, the material recovery container 12 is rotated and the state shown in FIG. The exhaust conductance of the vacuum pump 3 is reduced, and the vapor deposition material flowing toward the vacuum pump 3 can be efficiently attached to the material recovery container 12. At this time, the exhaust conductance is adjusted so that the degree of vacuum within the vacuum container 1 does not become worse than a predetermined degree of vacuum.

The vapor deposition material adhering to the material recovery container 12 is collected by taking out the material recovery container 12.

As described above, according to the vapor deposition apparatus of this embodiment, the material recovery container 12 is rotatably provided in the enlarged part 14a of the exhaust pipe 14, and the exhaust conductance inside the vacuum container 1 can be varied, so that the exhaust time can be changed. The inside of the vacuum container 1 can be evacuated without increasing the length, and a part of the deposited substance can be efficiently recovered.

[Effect of idea]

As described above, according to the vapor deposition apparatus according to this invention, the material recovery container is rotatably provided in the exhaust pipe, and the exhaust conductance can be varied.
This has the effect that the inside of the vacuum container can be evacuated in a short time and that the vapor deposition material can be efficiently recovered.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a conventional vapor deposition apparatus, FIG. 2 is a cross-sectional view of a vapor deposition apparatus according to an embodiment of the present invention in one operating state, and FIG. 3 is a cross-sectional view of the above-mentioned embodiment apparatus in another operating state. be. 1... Vacuum container, 12... Evaporation material recovery device,
3... Vacuum pump, 14... Exhaust pipe. In the figures, the same numbers indicate the same or equivalent parts.

Claims (1)

[Scope of utility model registration request] A vacuum container that houses a vapor deposition apparatus main body that generates a deposition substance, a vacuum pump that draws the vacuum into the vacuum container, and an exhaust pipe between the vacuum pump and the vacuum container so that the exhaust conductance can be varied. A vapor deposition apparatus comprising: a vapor deposition material recovery device that is rotatably provided and collects the vapor deposition material.