JPS57147255A - Multichip lsi package - Google Patents

Multichip lsi package

Info

Publication number
JPS57147255A
JPS57147255A JP3169181A JP3169181A JPS57147255A JP S57147255 A JPS57147255 A JP S57147255A JP 3169181 A JP3169181 A JP 3169181A JP 3169181 A JP3169181 A JP 3169181A JP S57147255 A JPS57147255 A JP S57147255A
Authority
JP
Japan
Prior art keywords
chip carrier
multichip
lsi package
multilayer wiring
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3169181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6217871B2 (enrdf_load_stackoverflow
Inventor
Toshihiko Watari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3169181A priority Critical patent/JPS57147255A/ja
Publication of JPS57147255A publication Critical patent/JPS57147255A/ja
Publication of JPS6217871B2 publication Critical patent/JPS6217871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP3169181A 1981-03-05 1981-03-05 Multichip lsi package Granted JPS57147255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3169181A JPS57147255A (en) 1981-03-05 1981-03-05 Multichip lsi package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3169181A JPS57147255A (en) 1981-03-05 1981-03-05 Multichip lsi package

Publications (2)

Publication Number Publication Date
JPS57147255A true JPS57147255A (en) 1982-09-11
JPS6217871B2 JPS6217871B2 (enrdf_load_stackoverflow) 1987-04-20

Family

ID=12338093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3169181A Granted JPS57147255A (en) 1981-03-05 1981-03-05 Multichip lsi package

Country Status (1)

Country Link
JP (1) JPS57147255A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6381844B1 (en) 1999-12-15 2002-05-07 Sun Microsystems, Inc. Method for thermally connecting a heat sink to a cabinet
FR2967763A1 (fr) * 2010-11-19 2012-05-25 Thales Sa Dispositif de dissipation de chaleur et carte electronique correspondante
CN109920755A (zh) * 2019-02-25 2019-06-21 天津大学 一种纳米银焊膏低压辅助烧结夹具及方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143395U (enrdf_load_stackoverflow) * 1989-05-02 1990-12-05

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6381844B1 (en) 1999-12-15 2002-05-07 Sun Microsystems, Inc. Method for thermally connecting a heat sink to a cabinet
FR2967763A1 (fr) * 2010-11-19 2012-05-25 Thales Sa Dispositif de dissipation de chaleur et carte electronique correspondante
CN109920755A (zh) * 2019-02-25 2019-06-21 天津大学 一种纳米银焊膏低压辅助烧结夹具及方法
CN109920755B (zh) * 2019-02-25 2021-01-05 天津大学 一种纳米银焊膏低压辅助烧结夹具及方法

Also Published As

Publication number Publication date
JPS6217871B2 (enrdf_load_stackoverflow) 1987-04-20

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