JPS57138165A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57138165A JPS57138165A JP56023959A JP2395981A JPS57138165A JP S57138165 A JPS57138165 A JP S57138165A JP 56023959 A JP56023959 A JP 56023959A JP 2395981 A JP2395981 A JP 2395981A JP S57138165 A JPS57138165 A JP S57138165A
- Authority
- JP
- Japan
- Prior art keywords
- film
- lead wire
- pad section
- bored
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W74/47—
-
- H10W74/137—
-
- H10W74/147—
-
- H10W70/60—
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/59—
-
- H10W72/952—
-
- H10W72/983—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56023959A JPS57138165A (en) | 1981-02-20 | 1981-02-20 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56023959A JPS57138165A (en) | 1981-02-20 | 1981-02-20 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57138165A true JPS57138165A (en) | 1982-08-26 |
| JPS628034B2 JPS628034B2 (OSRAM) | 1987-02-20 |
Family
ID=12125078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56023959A Granted JPS57138165A (en) | 1981-02-20 | 1981-02-20 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57138165A (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08501205A (ja) * | 1992-05-20 | 1996-02-13 | ザ ガバメント オブ ザ ユナイテッド ステイツ オブ アメリカ,アズ レプリゼンテッド バイ ザ セクレタリー,デパートメント オブ ヘルス アンド ヒューマン サービシーズ | Dna損傷因子に対する細胞の感受性を増強する方法および組成物 |
| WO2014162387A1 (ja) * | 2013-04-01 | 2014-10-09 | パイオニア株式会社 | ワイヤの接続構造及び電気機器 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53103375A (en) * | 1977-02-22 | 1978-09-08 | Toshiba Corp | Semiconductor device |
| JPS55150259A (en) * | 1979-05-11 | 1980-11-22 | Hitachi Ltd | Semiconductor device and method of fabricating the same |
| JPS55166942A (en) * | 1979-06-15 | 1980-12-26 | Hitachi Ltd | Semiconductor device |
-
1981
- 1981-02-20 JP JP56023959A patent/JPS57138165A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53103375A (en) * | 1977-02-22 | 1978-09-08 | Toshiba Corp | Semiconductor device |
| JPS55150259A (en) * | 1979-05-11 | 1980-11-22 | Hitachi Ltd | Semiconductor device and method of fabricating the same |
| JPS55166942A (en) * | 1979-06-15 | 1980-12-26 | Hitachi Ltd | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08501205A (ja) * | 1992-05-20 | 1996-02-13 | ザ ガバメント オブ ザ ユナイテッド ステイツ オブ アメリカ,アズ レプリゼンテッド バイ ザ セクレタリー,デパートメント オブ ヘルス アンド ヒューマン サービシーズ | Dna損傷因子に対する細胞の感受性を増強する方法および組成物 |
| WO2014162387A1 (ja) * | 2013-04-01 | 2014-10-09 | パイオニア株式会社 | ワイヤの接続構造及び電気機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628034B2 (OSRAM) | 1987-02-20 |
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