JPS57133673A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57133673A
JPS57133673A JP1949681A JP1949681A JPS57133673A JP S57133673 A JPS57133673 A JP S57133673A JP 1949681 A JP1949681 A JP 1949681A JP 1949681 A JP1949681 A JP 1949681A JP S57133673 A JPS57133673 A JP S57133673A
Authority
JP
Japan
Prior art keywords
region
mask
layer
nitride film
ions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1949681A
Other languages
Japanese (ja)
Inventor
Takashi Yasujima
Jiro Oshima
Yutaka Etsuno
Toshio Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1949681A priority Critical patent/JPS57133673A/en
Publication of JPS57133673A publication Critical patent/JPS57133673A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)

Abstract

PURPOSE:To form a base, etc. of a transistor accurately, and to improve characteristics by shaping a mask region consisting of a nitride film containing Ga to the predetermined region of a semiconductor substrate and forming an impurity introducing region surrounded by the mask region. CONSTITUTION:A thermal oxide film 9 is shaped to an N type epitaxial layer 1 on a substrate 2, windows 17 are molded to the mask layer forming region, and N ions are implanted. The CVD nitride film 13' is deposited onto the whole surface, and Ga ions are implanted by energy, the range thereof is made larger than the thickness of the film 13' and smaller than the range of the N ions, while using a resist layer 19 as a mask. GaIs diffused through heat treatment, and a base region 4 and a guard ring layer 7 are formed while the mask layer 6 consisting of the nitride film containing Ga is shaped. An emitter region 5 and a wiring region 8 are diffused, a PSG film 10 and electrodes 12, 15, 3 are formed, and the transistor is completed. Accordingly, an element in which a diffusion layer is shaped accurately at a desired position can be manufactured because the thermal stress of the nitride film mask is reduced and the generation of a crack, etc. can be prevented.
JP1949681A 1981-02-12 1981-02-12 Semiconductor device Pending JPS57133673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1949681A JPS57133673A (en) 1981-02-12 1981-02-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1949681A JPS57133673A (en) 1981-02-12 1981-02-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57133673A true JPS57133673A (en) 1982-08-18

Family

ID=12000975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1949681A Pending JPS57133673A (en) 1981-02-12 1981-02-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57133673A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4881113A (en) * 1985-10-31 1989-11-14 Kabushiki Kaisha Toshiba Semiconductor integrated circuits with a protection device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4881113A (en) * 1985-10-31 1989-11-14 Kabushiki Kaisha Toshiba Semiconductor integrated circuits with a protection device

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