JPS5654062A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5654062A JPS5654062A JP13011579A JP13011579A JPS5654062A JP S5654062 A JPS5654062 A JP S5654062A JP 13011579 A JP13011579 A JP 13011579A JP 13011579 A JP13011579 A JP 13011579A JP S5654062 A JPS5654062 A JP S5654062A
- Authority
- JP
- Japan
- Prior art keywords
- region
- film
- type
- contact window
- polycrystalline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0744—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common without components of the field effect type
- H01L27/075—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. lateral bipolar transistor, and vertical bipolar transistor and resistor
- H01L27/0755—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
- H01L27/0761—Vertical bipolar transistor in combination with diodes only
- H01L27/0766—Vertical bipolar transistor in combination with diodes only with Schottky diodes only
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
PURPOSE:To reduce the production process employing an SiO2 film, a polycrystalline Si film, a PSG film as a mask when an electrode contact window is formed in a bipolar type IC combining a transistor and a Schottky barrier diode. CONSTITUTION:An N<+> type collector contact region 2 and a P type base region 3 are formed by diffusion on an N type Si collector layer 1 which is entirely covered with an SiO2 film 4. With a photoresist mask, a collector contact window 6 is formed by etching on the region 2 and an emitter contact window 6, on a part of the region 3 corresponding to an N type emitter region 13 to be provided there. The film 4 is locally made thinner corresponding to the base contact window 8 and a contact window 9 for diodes and a polycrystalline Si film 11 and a PSG film 12 are applied thereon in layers. Thereafter, P is diffused into the film 12 by a heat treatment to form an N type emitter region 13 in the region 3. At the same time, a region 14 high in the concentration of an N type impurity is created in the region 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13011579A JPS5654062A (en) | 1979-10-09 | 1979-10-09 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13011579A JPS5654062A (en) | 1979-10-09 | 1979-10-09 | Production of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5654062A true JPS5654062A (en) | 1981-05-13 |
JPH0139221B2 JPH0139221B2 (en) | 1989-08-18 |
Family
ID=15026301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13011579A Granted JPS5654062A (en) | 1979-10-09 | 1979-10-09 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5654062A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5975659A (en) * | 1982-10-22 | 1984-04-28 | Fujitsu Ltd | Manufacture of semiconductor device |
JPS59209854A (en) * | 1983-05-13 | 1984-11-28 | 鐘淵化学工業株式会社 | Thin-film changed into multilayer and manufacture thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4940062A (en) * | 1972-07-13 | 1974-04-15 | Intersil Inc | |
JPS5121792A (en) * | 1974-08-16 | 1976-02-21 | Hitachi Ltd | Handotaisochino seizohoho |
-
1979
- 1979-10-09 JP JP13011579A patent/JPS5654062A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4940062A (en) * | 1972-07-13 | 1974-04-15 | Intersil Inc | |
JPS5121792A (en) * | 1974-08-16 | 1976-02-21 | Hitachi Ltd | Handotaisochino seizohoho |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5975659A (en) * | 1982-10-22 | 1984-04-28 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH035058B2 (en) * | 1982-10-22 | 1991-01-24 | Fujitsu Ltd | |
JPS59209854A (en) * | 1983-05-13 | 1984-11-28 | 鐘淵化学工業株式会社 | Thin-film changed into multilayer and manufacture thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0139221B2 (en) | 1989-08-18 |
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