JPS5712558A - Mos transistor having high withstand voltage - Google Patents

Mos transistor having high withstand voltage

Info

Publication number
JPS5712558A
JPS5712558A JP8687980A JP8687980A JPS5712558A JP S5712558 A JPS5712558 A JP S5712558A JP 8687980 A JP8687980 A JP 8687980A JP 8687980 A JP8687980 A JP 8687980A JP S5712558 A JPS5712558 A JP S5712558A
Authority
JP
Japan
Prior art keywords
parts
region
channel
withstand voltage
source region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8687980A
Inventor
Tsutomu Nozaki
Tadahiko Tanaka
Original Assignee
Sanyo Electric Co Ltd
Tokyo Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Tokyo Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP8687980A priority Critical patent/JPS5712558A/en
Publication of JPS5712558A publication Critical patent/JPS5712558A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0692Surface layout
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0611Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
    • H01L29/0615Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025Channel region of field-effect devices
    • H01L29/1029Channel region of field-effect devices of field-effect transistors
    • H01L29/1033Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure

Abstract

PURPOSE:To contrive to enhance withstand voltage of an MOS transistor by a method wherein the channel length at the bending parts at tip parts of a source region is made as longer than the other part. CONSTITUTION:The N<+> type source region 22 and a drain region 23 are formed in a comb-shape in an N type epitaxial layer 24 on a P type Si substrate 21, and the channel region 25 are formed between them by ion implantation being controlled to have the prescribed concentration. The channel length l' of the channel region 25 at the bending parts of tip edges of the source region 22 is longer than the channel length l of the other parts (to form the shape thereof with a curve having a large radius of curvature is also favorable). By this constitution, because channel resistance at that parts are larger than the other parts, electric line of force to go from the bottoms of the drain region 23 toward the bending parts is reduced, electric field is weakened and concentration of current can be prevented. Therefore a high withstand voltage can be attained.
JP8687980A 1980-06-25 1980-06-25 Mos transistor having high withstand voltage Pending JPS5712558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8687980A JPS5712558A (en) 1980-06-25 1980-06-25 Mos transistor having high withstand voltage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8687980A JPS5712558A (en) 1980-06-25 1980-06-25 Mos transistor having high withstand voltage

Publications (1)

Publication Number Publication Date
JPS5712558A true JPS5712558A (en) 1982-01-22

Family

ID=13899113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8687980A Pending JPS5712558A (en) 1980-06-25 1980-06-25 Mos transistor having high withstand voltage

Country Status (1)

Country Link
JP (1) JPS5712558A (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933740A (en) * 1986-11-26 1990-06-12 General Electric Company Insulated gate transistor with vertical integral diode and method of fabrication
US4987464A (en) * 1987-01-23 1991-01-22 Oki Electric Industry Co., Ltd. Encapsulated FET semiconductor device with large W/L ratio
EP0546377A2 (en) * 1991-12-12 1993-06-16 Power Integrations, Inc. Semiconductor device with improved breakdown voltage characteristics
EP0613187A3 (en) * 1993-02-15 1994-12-21 Fuji Electric Co Ltd High voltage MIS field effect transistor.
US6168983B1 (en) 1996-11-05 2001-01-02 Power Integrations, Inc. Method of making a high-voltage transistor with multiple lateral conduction layers
US6207994B1 (en) 1996-11-05 2001-03-27 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
US6501130B2 (en) 2001-01-24 2002-12-31 Power Integrations, Inc. High-voltage transistor with buried conduction layer
US6509220B2 (en) 2000-11-27 2003-01-21 Power Integrations, Inc. Method of fabricating a high-voltage transistor
US6635544B2 (en) 2001-09-07 2003-10-21 Power Intergrations, Inc. Method of fabricating a high-voltage transistor with a multi-layered extended drain structure
US6639277B2 (en) 1996-11-05 2003-10-28 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
EP1089345A3 (en) * 1999-09-28 2003-11-12 Fuji Electric Co. Ltd. Lateral power field-effect transistor
US6768171B2 (en) 2000-11-27 2004-07-27 Power Integrations, Inc. High-voltage transistor with JFET conduction channels
US6781198B2 (en) 2001-09-07 2004-08-24 Power Integrations, Inc. High-voltage vertical transistor with a multi-layered extended drain structure
US6815293B2 (en) 2001-09-07 2004-11-09 Power Intergrations, Inc. High-voltage lateral transistor with a multi-layered extended drain structure
US7115958B2 (en) 2001-10-29 2006-10-03 Power Integrations, Inc. Lateral power MOSFET for high switching speeds
US9601613B2 (en) 2007-02-16 2017-03-21 Power Integrations, Inc. Gate pullback at ends of high-voltage vertical transistor structure
US9660053B2 (en) 2013-07-12 2017-05-23 Power Integrations, Inc. High-voltage field-effect transistor having multiple implanted layers
US10325988B2 (en) 2013-12-13 2019-06-18 Power Integrations, Inc. Vertical transistor device structure with cylindrically-shaped field plates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568882A (en) * 1979-07-03 1981-01-29 Sharp Corp High dielectric strength field effect semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568882A (en) * 1979-07-03 1981-01-29 Sharp Corp High dielectric strength field effect semiconductor device

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933740A (en) * 1986-11-26 1990-06-12 General Electric Company Insulated gate transistor with vertical integral diode and method of fabrication
US4987464A (en) * 1987-01-23 1991-01-22 Oki Electric Industry Co., Ltd. Encapsulated FET semiconductor device with large W/L ratio
EP0546377A2 (en) * 1991-12-12 1993-06-16 Power Integrations, Inc. Semiconductor device with improved breakdown voltage characteristics
US5258636A (en) * 1991-12-12 1993-11-02 Power Integrations, Inc. Narrow radius tips for high voltage semiconductor devices with interdigitated source and drain electrodes
EP0613187A3 (en) * 1993-02-15 1994-12-21 Fuji Electric Co Ltd High voltage MIS field effect transistor.
US5523599A (en) * 1993-02-15 1996-06-04 Fuji Electric Co., Ltd. High voltage MIS field effect transistor
US6724041B2 (en) 1996-11-05 2004-04-20 Power Integrations, Inc. Method of making a high-voltage transistor with buried conduction regions
US6207994B1 (en) 1996-11-05 2001-03-27 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
US6777749B2 (en) 1996-11-05 2004-08-17 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
US6768172B2 (en) 1996-11-05 2004-07-27 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
US6168983B1 (en) 1996-11-05 2001-01-02 Power Integrations, Inc. Method of making a high-voltage transistor with multiple lateral conduction layers
US6570219B1 (en) 1996-11-05 2003-05-27 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
US6633065B2 (en) 1996-11-05 2003-10-14 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
US6828631B2 (en) 1996-11-05 2004-12-07 Power Integrations, Inc High-voltage transistor with multi-layer conduction region
US6639277B2 (en) 1996-11-05 2003-10-28 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
US6787437B2 (en) 1996-11-05 2004-09-07 Power Integrations, Inc. Method of making a high-voltage transistor with buried conduction regions
US6800903B2 (en) 1996-11-05 2004-10-05 Power Integrations, Inc. High-voltage transistor with multi-layer conduction region
EP1089345A3 (en) * 1999-09-28 2003-11-12 Fuji Electric Co. Ltd. Lateral power field-effect transistor
US6509220B2 (en) 2000-11-27 2003-01-21 Power Integrations, Inc. Method of fabricating a high-voltage transistor
US6768171B2 (en) 2000-11-27 2004-07-27 Power Integrations, Inc. High-voltage transistor with JFET conduction channels
US6504209B2 (en) 2001-01-24 2003-01-07 Power Integrations, Inc. High-voltage transistor with buried conduction layer
US6501130B2 (en) 2001-01-24 2002-12-31 Power Integrations, Inc. High-voltage transistor with buried conduction layer
US6818490B2 (en) 2001-01-24 2004-11-16 Power Integrations, Inc. Method of fabricating complementary high-voltage field-effect transistors
US6750105B2 (en) 2001-09-07 2004-06-15 Power Integrations, Inc. Method of fabricating a high-voltage transistor with a multi-layered extended drain structure
US6787847B2 (en) 2001-09-07 2004-09-07 Power Integrations, Inc. High-voltage vertical transistor with a multi-layered extended drain structure
US6781198B2 (en) 2001-09-07 2004-08-24 Power Integrations, Inc. High-voltage vertical transistor with a multi-layered extended drain structure
US6815293B2 (en) 2001-09-07 2004-11-09 Power Intergrations, Inc. High-voltage lateral transistor with a multi-layered extended drain structure
US6667213B2 (en) 2001-09-07 2003-12-23 Power Integrations, Inc. Method of fabricating a high-voltage transistor with a multi-layered extended drain structure
US6635544B2 (en) 2001-09-07 2003-10-21 Power Intergrations, Inc. Method of fabricating a high-voltage transistor with a multi-layered extended drain structure
US6838346B2 (en) 2001-09-07 2005-01-04 Power Integrations, Inc. Method of fabricating a high-voltage transistor with a multi-layered extended drain structure
US6882005B2 (en) 2001-09-07 2005-04-19 Power Integrations, Inc. High-voltage vertical transistor with a multi-layered extended drain structure
US6987299B2 (en) 2001-09-07 2006-01-17 Power Integrations, Inc. High-voltage lateral transistor with a multi-layered extended drain structure
US7115958B2 (en) 2001-10-29 2006-10-03 Power Integrations, Inc. Lateral power MOSFET for high switching speeds
US9601613B2 (en) 2007-02-16 2017-03-21 Power Integrations, Inc. Gate pullback at ends of high-voltage vertical transistor structure
US9660053B2 (en) 2013-07-12 2017-05-23 Power Integrations, Inc. High-voltage field-effect transistor having multiple implanted layers
US10325988B2 (en) 2013-12-13 2019-06-18 Power Integrations, Inc. Vertical transistor device structure with cylindrically-shaped field plates

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