JPS57124457A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57124457A
JPS57124457A JP1006181A JP1006181A JPS57124457A JP S57124457 A JPS57124457 A JP S57124457A JP 1006181 A JP1006181 A JP 1006181A JP 1006181 A JP1006181 A JP 1006181A JP S57124457 A JPS57124457 A JP S57124457A
Authority
JP
Japan
Prior art keywords
flange
semiconductor chip
stem
chip
press working
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1006181A
Other languages
Japanese (ja)
Inventor
Yasuo Shimizu
Sadashige Hosomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1006181A priority Critical patent/JPS57124457A/en
Priority to DE19813133398 priority patent/DE3133398A1/en
Publication of JPS57124457A publication Critical patent/JPS57124457A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/382—Contact thermal transfer or sublimation processes
    • B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer
    • B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B33/00—Colour photography, other than mere exposure or projection of a colour film

Abstract

PURPOSE:To avoid the generation of strain at the time of the attaching of a radiating plate, and to prevent the generation of the trouble of the semiconductor device by mounting a semiconductor chip onto a stem surface at the same side as the surface to be worked of a flange to which press working is executed. CONSTITUTION:When the semiconductor chip 28 is mounted to a stem formed by attaching an inner lead 26 to the flange 22, the semiconductor chip 28 is mounted onto the stem surface at the same side as the surface to be worked of the flange 22 to which the press working is executed. The semiconductor chip 28 is mounted onto the stem surface at the reverse side to the direction that the fringe section of the flange is bent through the press working at that time. Accordingly, when the chip 28 and the lead 26 are connected and the chip 28 is sealed by a shell member 30, bending in the opposite direction to bending generated in a press process is formed in the flange, both are denied mutually, and the flange surface is flatly shaped.
JP1006181A 1980-08-28 1981-01-26 Manufacture of semiconductor device Pending JPS57124457A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1006181A JPS57124457A (en) 1981-01-26 1981-01-26 Manufacture of semiconductor device
DE19813133398 DE3133398A1 (en) 1980-08-28 1981-08-24 Film arrangement for ink transfer by means of heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1006181A JPS57124457A (en) 1981-01-26 1981-01-26 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS57124457A true JPS57124457A (en) 1982-08-03

Family

ID=11739863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1006181A Pending JPS57124457A (en) 1980-08-28 1981-01-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57124457A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025467B1 (en) * 1969-12-24 1975-08-23
JPS5352070A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Semiconductor unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025467B1 (en) * 1969-12-24 1975-08-23
JPS5352070A (en) * 1976-10-22 1978-05-12 Hitachi Ltd Semiconductor unit

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