JPS5434764A - Package structure - Google Patents

Package structure

Info

Publication number
JPS5434764A
JPS5434764A JP10047977A JP10047977A JPS5434764A JP S5434764 A JPS5434764 A JP S5434764A JP 10047977 A JP10047977 A JP 10047977A JP 10047977 A JP10047977 A JP 10047977A JP S5434764 A JPS5434764 A JP S5434764A
Authority
JP
Japan
Prior art keywords
package
package structure
swelling
cracking
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10047977A
Other languages
Japanese (ja)
Inventor
Yasushi Asami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10047977A priority Critical patent/JPS5434764A/en
Publication of JPS5434764A publication Critical patent/JPS5434764A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE: To prevent a package from cracking by dispersing stress applied to the package when a lead is bent, by slightly denting the joint parts from which the leads of the package surface part protrude while swelling its circumference.
COPYRIGHT: (C)1979,JPO&Japio
JP10047977A 1977-08-24 1977-08-24 Package structure Pending JPS5434764A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10047977A JPS5434764A (en) 1977-08-24 1977-08-24 Package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10047977A JPS5434764A (en) 1977-08-24 1977-08-24 Package structure

Publications (1)

Publication Number Publication Date
JPS5434764A true JPS5434764A (en) 1979-03-14

Family

ID=14275044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10047977A Pending JPS5434764A (en) 1977-08-24 1977-08-24 Package structure

Country Status (1)

Country Link
JP (1) JPS5434764A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140641U (en) * 1982-03-15 1983-09-21 京セラ株式会社 Glass-sealed semiconductor package
JPS59182934U (en) * 1983-05-24 1984-12-06 日本電気株式会社 Metal package for hybrid IC
JPS6260717A (en) * 1985-09-06 1987-03-17 Nippon Piston Ring Co Ltd Constant interval arranging/transferring method for matter
JPS6260716A (en) * 1985-09-06 1987-03-17 Nippon Piston Ring Co Ltd Equi-interval arranging method and device for powder mold
JP2003331704A (en) * 2002-05-09 2003-11-21 Uchihashi Estec Co Ltd Thin fuse and its manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58140641U (en) * 1982-03-15 1983-09-21 京セラ株式会社 Glass-sealed semiconductor package
JPS59182934U (en) * 1983-05-24 1984-12-06 日本電気株式会社 Metal package for hybrid IC
JPS6260717A (en) * 1985-09-06 1987-03-17 Nippon Piston Ring Co Ltd Constant interval arranging/transferring method for matter
JPS6260716A (en) * 1985-09-06 1987-03-17 Nippon Piston Ring Co Ltd Equi-interval arranging method and device for powder mold
JP2003331704A (en) * 2002-05-09 2003-11-21 Uchihashi Estec Co Ltd Thin fuse and its manufacturing method

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