JPS57124446A - Die bond apparatus - Google Patents

Die bond apparatus

Info

Publication number
JPS57124446A
JPS57124446A JP56010974A JP1097481A JPS57124446A JP S57124446 A JPS57124446 A JP S57124446A JP 56010974 A JP56010974 A JP 56010974A JP 1097481 A JP1097481 A JP 1097481A JP S57124446 A JPS57124446 A JP S57124446A
Authority
JP
Japan
Prior art keywords
adsorbing
lead frame
shaft
forth
needle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56010974A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325703B2 (enExample
Inventor
Toshio Yonemura
Kazuhiro Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56010974A priority Critical patent/JPS57124446A/ja
Publication of JPS57124446A publication Critical patent/JPS57124446A/ja
Publication of JPS6325703B2 publication Critical patent/JPS6325703B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP56010974A 1981-01-26 1981-01-26 Die bond apparatus Granted JPS57124446A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56010974A JPS57124446A (en) 1981-01-26 1981-01-26 Die bond apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56010974A JPS57124446A (en) 1981-01-26 1981-01-26 Die bond apparatus

Publications (2)

Publication Number Publication Date
JPS57124446A true JPS57124446A (en) 1982-08-03
JPS6325703B2 JPS6325703B2 (enExample) 1988-05-26

Family

ID=11765124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56010974A Granted JPS57124446A (en) 1981-01-26 1981-01-26 Die bond apparatus

Country Status (1)

Country Link
JP (1) JPS57124446A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126842A (ja) * 1983-12-14 1985-07-06 Marine Instr Co Ltd ダイボンデイング方法
JPS60227428A (ja) * 1984-04-26 1985-11-12 Shinkawa Ltd チツプボンデイング装置
JPS61164035U (enExample) * 1985-03-29 1986-10-11

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0484507U (enExample) * 1990-11-29 1992-07-22

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588341A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Assembling device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588341A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Assembling device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126842A (ja) * 1983-12-14 1985-07-06 Marine Instr Co Ltd ダイボンデイング方法
JPS60227428A (ja) * 1984-04-26 1985-11-12 Shinkawa Ltd チツプボンデイング装置
JPS61164035U (enExample) * 1985-03-29 1986-10-11

Also Published As

Publication number Publication date
JPS6325703B2 (enExample) 1988-05-26

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